Syriopoulos Georgios, Poulopoulos Ioannis, Zervos Charalampos, Kyriazi Evrydiki, Poulimenos Aggelos, Szaj Michal, Missinne Jeroen, van Steenberge Geert, Avramopoulos Hercules
Photonics Communications Research Laboratory, National Technical University of Athens, 9 Iroon Polytechniou Street, Zografou, 15773 Athens, Greece.
Engineering Technology Solutions E.E., 15344 Athens, Greece.
Sensors (Basel). 2023 Sep 8;23(18):7765. doi: 10.3390/s23187765.
The use of composite materials has seen widespread adoption in modern aerospace industry. This has been facilitated due to their favourable mechanical characteristics, namely, low weight and high stiffness and strength. For broader implementation of those materials though, the out-of-autoclave production processes have to be optimized, to allow for higher reliability of the parts produced as well as cost reduction and improved production speed. This optimization can be achieved by monitoring and controlling resin filling and curing cycles. Photonic Integrated Circuits (PICs), and, in particular, Silicon Photonics, owing to their fast response, small size, ability to operate at higher temperatures, immunity to electromagnetic interference, and compatibility with CMOS fabrication techniques, can offer sensing solutions fulfilling the requirements for composite material production using carbon fibres. In this paper, we demonstrate a passive optical temperature sensor, based on a 220 nm height Silicon-on-Insulator platform, embedded in a composite tool used for producing RTM-6 composite parts of high quality (for use in the aerospace industry). The design methodology of the photonic circuit as well as the experimental results and comparison with the industry standard thermocouples during a thermal cycling of the tool are presented. The optical sensor exhibits high sensitivity (85 pm/°C), high linearity (R = 0.944), and is compatible with the RTM-6 production process, operating up to 180 °C.
复合材料在现代航空航天工业中已得到广泛应用。由于其良好的机械特性,即重量轻、刚度和强度高,这一应用得以顺利推进。然而,为了更广泛地应用这些材料,必须优化非热压罐生产工艺,以提高所生产部件的可靠性,降低成本并提高生产速度。这种优化可以通过监测和控制树脂填充和固化周期来实现。光子集成电路(PIC),特别是硅光子学,由于其响应速度快、尺寸小、能够在较高温度下工作、抗电磁干扰以及与CMOS制造技术兼容,能够提供满足使用碳纤维生产复合材料要求的传感解决方案。在本文中,我们展示了一种基于220nm高度绝缘体上硅平台的无源光学温度传感器,该传感器嵌入用于生产高质量RTM-6复合材料部件(用于航空航天工业)的复合工具中。本文介绍了光子电路的设计方法以及工具热循环期间的实验结果,并与行业标准热电偶进行了比较。该光学传感器具有高灵敏度(85pm/°C)、高线性度(R = 0.944),并且与RTM-6生产工艺兼容,可在高达180°C的温度下工作。