Zhang Yu, Yu Xianchong, Chen Ziyuan, Wu Song, Lai Haiqi, Ta Shiwo, Lin Tingyu, Yang Guannan, Cui Chengqiang
State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, China.
State Key Laboratory of Advanced Materials and Electronic Components, Fenghua Advanced Technology Co., Ltd., Zhaoqing 526020, China.
Micromachines (Basel). 2023 Nov 9;14(11):2079. doi: 10.3390/mi14112079.
In this study, we present a facile method for preparing oxidation-resistant Cu nanoparticles through a liquid-phase reduction with imidazole compounds (imidazole, 2-methylimidazole, 2-phenylimidazole, and benzimidazole) that serve as protective and dispersing agents. Through a complexation reaction between Cu atoms, the imidazole compounds can form a protective film on the Cu nanoparticles to prevent the particles from rapidly oxidizing. We compared the effects of the four kinds of imidazole compounds on the oxidation resistance and sintering properties of Cu particles. The Cu particles prepared with benzimidazole could be stored in the air for 30 days without being oxidized. After sintering at 300 °C and 2 MPa, the joint of the particles could reach a shear strength of 32 MPa, which meets the requirements for microelectronic packaging.
在本研究中,我们提出了一种简便的方法,通过用咪唑化合物(咪唑、2-甲基咪唑、2-苯基咪唑和苯并咪唑)作为保护和分散剂进行液相还原,来制备抗氧化铜纳米颗粒。通过铜原子之间的络合反应,咪唑化合物可以在铜纳米颗粒上形成一层保护膜,以防止颗粒快速氧化。我们比较了这四种咪唑化合物对铜颗粒抗氧化性和烧结性能的影响。用苯并咪唑制备的铜颗粒可以在空气中储存30天而不被氧化。在300℃和2MPa下烧结后,颗粒的接头可以达到32MPa的剪切强度,满足微电子封装的要求。