Shimabukuro Masaya, Morinobu Miki, Tsuchiya Akira, Kishida Ryo, Kawashita Masakazu, Ishikawa Kunio
Faculty of Dental Science, Kyushu University, Fukuoka, Japan.
Institute of Biomaterials and Bioengineering, Tokyo Medical and Dental University, Tokyo, Japan.
Sci Technol Adv Mater. 2024 Jan 10;25(1):2303327. doi: 10.1080/14686996.2024.2303327. eCollection 2024.
Implant-associated infections are threatening and devastating complications that lead to bone destruction and loss. As a smooth surface is suitable for inhibiting bacterial adhesion, endowing antibacterial activity to the Ti surface without any structural changes in the surface topography is an effective strategy for preventing infection. The thin film on the Ti-6Al-4 V surface was functionalized to endow antibacterial activity by immersion in a Cu(OH) solution. The resulting surface maintains the surface topography with a surface roughness of 0.03 μm even after the immersion in the Cu(OH) solution. Moreover, Cu was detected at approximately 10 atom% from the surface and was present up to a depth of 30 nm of thin film. In vitro experiments revealed that the resulting surface exhibited antibacterial activity against methicillin-resistant and allowed the cellular proliferation, differentiation, and calcification of MC3T3-E1 cells. Furthermore, in vivo experiments determined that the presence of Cu in the thin film on the Ti-6Al-4 V surface led to no inflammatory reactions, including bone resorption. Thus, immersion in a Cu(OH) solution incorporates and immobilizes Cu into the thin film on the Ti-6Al-4 V surface without any structural alternations in the surface topography, and the resulting smooth surface exhibits antibacterial activity and osteogenic cell compatibility without cytotoxicity or inflammatory reactions. Our findings provide fundamental insights into the surface design of Ti-based medical devices, to achieve bone reconstruction and infection prevention.
植入相关感染是具有威胁性且极具破坏性的并发症，会导致骨质破坏和流失。由于光滑表面适合抑制细菌黏附，在不改变钛表面形貌结构的情况下赋予其抗菌活性是预防感染的有效策略。通过将Ti-6Al-4V表面浸入Cu(OH)溶液中，使薄膜功能化以赋予抗菌活性。即使浸入Cu(OH)溶液后，所得表面仍保持表面粗糙度为0.03μm的表面形貌。此外，从表面检测到约10原子%的铜，并且在薄膜深度达30nm处均有铜存在。体外实验表明，所得表面对耐甲氧西林菌具有抗菌活性，并能促进MC3T3-E1细胞的细胞增殖、分化和钙化。此外，体内实验确定，Ti-6Al-4V表面薄膜中铜的存在不会引发包括骨吸收在内的炎症反应。因此，浸入Cu(OH)溶液可将铜纳入并固定在Ti-6Al-4V表面的薄膜中，而不会改变表面形貌结构，所得的光滑表面具有抗菌活性和成骨细胞相容性，且无细胞毒性或炎症反应。我们的研究结果为钛基医疗器械的表面设计提供了基础见解，以实现骨重建和感染预防。
