Jin Qun, Guo Tianxiao, Pérez Nicolás, Yang Nianjun, Jiang Xin, Nielsch Kornelius, Reith Heiko
Institute for Metallic Materials, Leibniz Institute for Solid State and Materials Research, 01069, Dresden, Germany.
Institute of Materials Engineering, University of Siegen, 57076, Siegen, Germany.
Nanomicro Lett. 2024 Feb 20;16(1):126. doi: 10.1007/s40820-024-01342-3.
Multidimensional integration and multifunctional component assembly have been greatly explored in recent years to extend Moore's Law of modern microelectronics. However, this inevitably exacerbates the inhomogeneity of temperature distribution in microsystems, making precise temperature control for electronic components extremely challenging. Herein, we report an on-chip micro temperature controller including a pair of thermoelectric legs with a total area of 50 × 50 μm, which are fabricated from dense and flat freestanding BiTe-based thermoelectric nano films deposited on a newly developed nano graphene oxide membrane substrate. Its tunable equivalent thermal resistance is controlled by electrical currents to achieve energy-efficient temperature control for low-power electronics. A large cooling temperature difference of 44.5 K at 380 K is achieved with a power consumption of only 445 μW, resulting in an ultrahigh temperature control capability over 100 K mW. Moreover, an ultra-fast cooling rate exceeding 2000 K s and excellent reliability of up to 1 million cycles are observed. Our proposed on-chip temperature controller is expected to enable further miniaturization and multifunctional integration on a single chip for microelectronics.
近年来,为了拓展现代微电子学的摩尔定律,人们对多维集成和多功能组件组装进行了大量探索。然而,这不可避免地加剧了微系统中温度分布的不均匀性,使得对电子元件进行精确的温度控制极具挑战性。在此,我们报道了一种片上微温度控制器,它包括一对总面积为50×50μm的热电腿,这些热电腿由沉积在新开发的纳米氧化石墨烯膜基板上的致密且平整的独立式碲化铋基热电纳米薄膜制成。其可调等效热阻由电流控制,以实现对低功耗电子设备的节能温度控制。在380K时,仅消耗445μW的功耗就能实现44.5K的大冷却温差,从而实现超过100K/mW的超高温度控制能力。此外,还观察到超过2000K/s的超快冷却速率和高达100万次循环的优异可靠性。我们提出的片上温度控制器有望实现微电子在单个芯片上的进一步小型化和多功能集成。