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通过插入电子烯设计无势垒金属/MoS接触。

Designing barrier-free metal/MoS contacts through electrene insertion.

作者信息

Rafiee Diznab Mohammad, Rumson Adrian F, Maassen Jesse, Johnson Erin R

机构信息

Department of Physics and Atmospheric Science, Dalhousie University, 6310 Coburg Road, Halifax, Nova Scotia, B3H 4R2, Canada.

Department of Chemistry, Dalhousie University, 6243 Alumni Crescent, Halifax, Nova Scotia, B3H 4R2, Canada.

出版信息

Phys Chem Chem Phys. 2024 Jun 19;26(24):16947-16954. doi: 10.1039/d3cp06112d.

Abstract

Transition-metal dichalcogenides (TMDCs), including MoS, have great potential in electronics applications. However, achieving low-resistance metal contacts is a challenge that impacts their performance in nanodevices due to strong Fermi-level pinning and the presence of a tunnelling barrier. As a solution, we explore a strategy of inserting monolayers of alkaline-earth sub-pnictide electrenes with a general formula of [MX]e (M = Ca, Sr, Ba; X = N, P, As, Sb) between the TMDC and the metal. These electrenes possess two-dimensional sheets of charge on their surfaces that can be readily donated when interfaced with a TMDC semiconductor, thereby lowering its conduction band below the Fermi level and eliminating the Schottky and tunnelling barriers. In this work, density-functional theory (DFT) calculations were performed for metal/electrene/MoS heterojunctions for all stable MX electrenes and both Au and Cu metals. To identify the material combinations that provide the most effective Ohmic contact, the charge transfer, band structure, and electrostatic potential were computed. Linear correlations were found between the charge donated to the MoS and both the electrene surface charge and work function. Overall, CaN appears to be the most promising electrene for achieving an Ohmic metal/MoS contact due to its high surface charge density.

摘要

包括二硫化钼(MoS₂)在内的过渡金属二硫属化物(TMDCs)在电子应用中具有巨大潜力。然而,由于强费米能级钉扎和隧穿势垒的存在,实现低电阻金属接触是一个挑战,这会影响它们在纳米器件中的性能。作为一种解决方案,我们探索了一种策略,即在TMDC和金属之间插入通式为[MX]e(M = Ca、Sr、Ba;X = N、P、As、Sb)的碱土亚磷族电子烯单层。这些电子烯在其表面具有二维电荷层,当与TMDC半导体接触时,这些电荷层可以很容易地被捐赠,从而将其导带降低到费米能级以下,并消除肖特基势垒和隧穿势垒。在这项工作中,对所有稳定的MX电子烯以及Au和Cu金属的金属/电子烯/MoS₂异质结进行了密度泛函理论(DFT)计算。为了确定提供最有效欧姆接触的材料组合,计算了电荷转移、能带结构和静电势。发现捐赠给MoS₂的电荷与电子烯表面电荷和功函数之间存在线性相关性。总体而言,由于CaN具有高表面电荷密度,它似乎是实现欧姆金属/MoS₂接触最有前景的电子烯。

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