Wang Qian, Deng Bei, Shi Xingqiang
Harbin Institute of Technology, Harbin 150080, China.
Phys Chem Chem Phys. 2017 Oct 4;19(38):26151-26157. doi: 10.1039/c7cp05109c.
Two-dimensional (2D) transition metal dichalcogenides (TMDCs) have recently attracted tremendous interest for fundamental studies and applications. High contact resistances between the metal electrodes and the 2D TMDCs, usually composed of a tunneling barrier (TB) and a Schottky barrier (SB), are the key bottleneck to the realization of high performance devices based on such systems. Here, from van der Waals density functional theory calculations, we demonstrate that strain can provide a feasible means to reduce the contact resistances between, for example, 2D semiconductor MoS and metal surfaces, in both strong and weak coupling regimes. Both the SB and TB are lowered significantly with the increasing tensile strain in both the coupling regimes. Especially, the SB can reduce to zero in all configurations considered, with tensile strain increasing to ∼4% or above. The mechanism of SB reduction under tensile strain is attributed to the increase of the MoS affinity energy since the monolayer MoS conduction band minimum (CBm) is derived from anti-bonding states. Thus, the SB in other semiconducting TMDCs with an anti-bonding CBm (for n-type contact) could also be reduced to zero by tensile strain. Our discoveries thus shed a new and general light on minimizing the contact resistance of semiconducting TMDCs-metal based contacts and this can also prove applicable to other 2D semiconductors, e.g. phosphorene.
二维(2D)过渡金属二硫属化物(TMDCs)近来在基础研究和应用方面引起了极大关注。金属电极与二维TMDCs之间的高接触电阻,通常由隧穿势垒(TB)和肖特基势垒(SB)组成,是基于此类系统实现高性能器件的关键瓶颈。在此,通过范德华密度泛函理论计算,我们证明应变能够提供一种可行的方法来降低例如二维半导体MoS与金属表面在强耦合和弱耦合两种情况下的接触电阻。在这两种耦合情况下,随着拉伸应变的增加,SB和TB均显著降低。特别地,在所考虑的所有构型中,随着拉伸应变增加至约4%或更高,SB可降至零。拉伸应变下SB降低的机制归因于MoS亲和能的增加,因为单层MoS导带最小值(CBm)源自反键态。因此,对于具有反键CBm(用于n型接触)的其他半导体TMDCs,其SB也可通过拉伸应变降至零。我们的发现因此为最小化半导体TMDCs-金属基接触的接触电阻提供了新的通用思路,并且这也可证明适用于其他二维半导体,例如黑磷。