GPL Photonics Laboratory, State Key Laboratory of Luminescence Science and Technology, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, China.
University of Chinese Academy of Sciences, Beijing, China.
Nature. 2024 Jun;630(8015):77-83. doi: 10.1038/s41586-024-07398-w. Epub 2024 May 15.
Intensity, polarization and wavelength are intrinsic characteristics of light. Characterizing light with arbitrarily mixed information on polarization and spectrum is in high demand. Despite the extensive efforts in the design of polarimeters and spectrometers, concurrently yielding high-dimensional signatures of intensity, polarization and spectrum of the light fields is challenging and typically requires complicated integration of polarization- and/or wavelength-sensitive elements in the space or time domains. Here we demonstrate that simple thin-film interfaces with spatial and frequency dispersion can project and tailor polarization and spectrum responses in the wavevector domain. By this means, high-dimensional light information can be encoded into single-shot imaging and deciphered with the assistance of a deep residual network. To the best of our knowledge, our work not only enables full characterization of light with arbitrarily mixed full-Stokes polarization states across a broadband spectrum with a single device and a single measurement but also presents comparable, if not better, performance than state-of-the-art single-purpose miniaturized polarimeters or spectrometers. Our approach can be readily used as an alignment-free retrofit for the existing imaging platforms, opening up new paths to ultra-compact and high-dimensional photodetection and imaging.
光的强度、偏振和波长是其固有特性。对偏振和光谱任意混合信息的光进行特征描述具有很高的需求。尽管在偏振计和光谱仪的设计方面进行了广泛的研究,但同时产生光场强度、偏振和光谱的高维特征仍然具有挑战性,通常需要在空间或时间域中复杂地集成偏振和/或波长敏感元件。在这里,我们证明了具有空间和频率色散的简单薄膜界面可以在波矢域中投影和调整偏振和光谱响应。通过这种方式,可以将高维光信息编码为单次拍摄成像,并借助深度残差网络进行解码。据我们所知,我们的工作不仅能够用单个设备和单次测量来实现对任意混合全斯托克斯偏振状态的宽带光谱的全特征描述,而且与最先进的专用小型化偏振计或光谱仪相比,其性能相当,甚至更好。我们的方法可以很容易地用作现有成像平台的免对准改造,为超紧凑和高维光电探测和成像开辟了新的途径。