Castro-Ramirez Leonor, Espinoza-Salcedo María, Huamani-Echaccaya José, Ladera-Castañeda Marysela, Cervantes-Ganoza Luis, Hernández-Huamaní Emily, Aroste-Andía Rosa, Gavilán-Chávez Percy, Cayo-Rojas César
Postgraduate School, Universidad Privada Antenor Orrego, Trujillo, Peru.
School of Stomatology, Universidad Privada San Juan Bautista, Lima, Peru.
Clin Cosmet Investig Dent. 2024 May 24;16:153-165. doi: 10.2147/CCIDE.S465226. eCollection 2024.
This study aimed to evaluate the effects of polywave and monowave light-emitting diode curing units on the microtensile bond strength and failure types of three bulk-fill resin composites.
This in vitro experimental study was performed on 180 microbars obtained from human third molars and were distributed into 12 groups according to the type of bulk-fill resin composite and the light-curing unit. Third molars were restored using Filtek One Bulk Fill Restorative, Tetric N-Ceram Bulk Fill, and Opus Bulk Fill resin composites was light-cured with Elipar Deep Cure L and Valo in three modes: standard, high power, and extra power. Subsequently, microtensile analysis was carried out with a universal testing machine and the type of failure with an optical stereomicroscope. For statistical analysis, the Kruskal-Wallis H-test was used, with the Bonferroni post hoc test and Fisher's exact test, considering a significance of p<0.05.
There were significant differences in the microtensile bond strength between the Filtek One Bulk Fill restorative and Opus Bulk-Fill (p = 0.042) when light was cured with the polywave unit at standard power. On the other hand, the Filtek One Bulk Fill Restorative and Opus Bulk Fill resins showed significant differences in microtensile bond strength when light was cured with the monowave unit compared with the polywave unit (p<0.05).
The presence of alternative photoinitiator systems that are more reactive than camphorquinone produced higher microtensile bond strength in Tetric N-Ceram Bulk Fill and Opus Bulk Fill resins when light-cured with a high and standard polywave unit, respectively, compared to Filtek One Bulk Fill resins. Finally, Tetric N-Ceram Bulk Fill and Opus Bulk Fill resins had the highest percentage of mixed failures, while Filtek One Bulk Fill resin had adhesive failures, which was related to its lower microtensile bond strength.
本研究旨在评估多波和单波发光二极管固化灯对三种大块充填树脂复合材料微拉伸粘结强度及破坏类型的影响。
本体外实验研究使用从人类第三磨牙获取的180个微条,并根据大块充填树脂复合材料类型和光固化灯分为12组。使用Filtek One Bulk Fill Restorative、Tetric N-Ceram Bulk Fill和Opus Bulk Fill树脂复合材料修复第三磨牙,并用Elipar Deep Cure L和Valo以三种模式进行光固化:标准模式、高功率模式和超功率模式。随后,使用万能试验机进行微拉伸分析,并使用光学体视显微镜观察破坏类型。进行统计分析时,采用Kruskal-Wallis H检验、Bonferroni事后检验和Fisher精确检验,显著性水平设定为p<0.05。
当使用多波固化灯在标准功率下光固化时,Filtek One Bulk Fill修复材料和Opus Bulk-Fill之间的微拉伸粘结强度存在显著差异(p = 0.042)。另一方面,与多波固化灯相比,当使用单波固化灯光固化时,Filtek One Bulk Fill修复材料和Opus Bulk Fill树脂的微拉伸粘结强度存在显著差异(p<0.05)。
与Filtek One Bulk Fill树脂相比,当分别使用高功率和标准功率的多波固化灯光固化时,Tetric N-Ceram Bulk Fill和Opus Bulk Fill树脂中存在比樟脑醌更具反应性的替代光引发体系,从而产生了更高的微拉伸粘结强度。最后,Tetric N-Ceram Bulk Fill和Opus Bulk Fill树脂的混合破坏百分比最高,而Filtek One Bulk Fill树脂发生粘结破坏,这与其较低的微拉伸粘结强度有关。