Wang Ruixuan, Li Jingwei, Cai Lutong, Li Qing
Opt Lett. 2024 Jun 1;49(11):2934-2937. doi: 10.1364/OL.521157.
The existing silicon-carbide-on-insulator photonic platform utilizes a thin layer of silicon dioxide under silicon carbide (SiC) to provide optical confinement and mode isolation. Here, we replace the underneath silicon dioxide layer with 1-µm-thick aluminum nitride and demonstrate a 4H-silicon-carbide-on-aluminum-nitride integrated photonic platform for the first time to our knowledge. Efficient grating couplers, low-loss waveguides, and compact microring resonators with intrinsic quality factors up to 210,000 are fabricated. In addition, by undercutting the aluminum nitride layer, the intrinsic quality factor of the silicon carbide microring is improved by nearly one order of magnitude (1.8 million). Finally, an optical pump-probe method is developed to measure the thermal conductivity of the aluminum nitride layer, which is estimated to be over 30 times of that of silicon dioxide.
现有的绝缘体上碳化硅光子平台利用碳化硅(SiC)下方的一层薄二氧化硅来提供光限制和模式隔离。在此,我们用1微米厚的氮化铝取代下方的二氧化硅层,并首次据我们所知展示了一种基于氮化铝的4H碳化硅集成光子平台。制造出了高效光栅耦合器、低损耗波导以及本征品质因数高达210,000的紧凑型微环谐振器。此外,通过对氮化铝层进行底切,碳化硅微环的本征品质因数提高了近一个数量级(达到180万)。最后,开发了一种光泵浦 - 探测方法来测量氮化铝层的热导率,估计其热导率是二氧化硅的30倍以上。