Lopez-Rodriguez Bruno, van der Kolk Roald, Aggarwal Samarth, Sharma Naresh, Li Zizheng, van der Plaats Daniel, Scholte Thomas, Chang Jin, Gröblacher Simon, Pereira Silvania F, Bhaskaran Harish, Zadeh Iman Esmaeil
Department of Imaging Physics (ImPhys), Faculty of Applied Sciences, Delft University of Technology, Delft 2628 CJ, The Netherlands.
Kavli Institute of Nanoscience, Delft University of Technology, Delft 2628 CD, The Netherlands.
ACS Photonics. 2023 Sep 21;10(10):3748-3754. doi: 10.1021/acsphotonics.3c00968. eCollection 2023 Oct 18.
Integrated photonic platforms have proliferated in recent years, each demonstrating its unique strengths and shortcomings. Given the processing incompatibilities of different platforms, a formidable challenge in the field of integrated photonics still remains for combining the strengths of different optical materials in one hybrid integrated platform. Silicon carbide is a material of great interest because of its high refractive index, strong second- and third-order nonlinearities, and broad transparency window in the visible and near-infrared range. However, integrating silicon carbide (SiC) has been difficult, and current approaches rely on transfer bonding techniques that are time-consuming, expensive, and lacking precision in layer thickness. Here, we demonstrate high-index amorphous silicon carbide (a-SiC) films deposited at 150 °C and verify the high performance of the platform by fabricating standard photonic waveguides and ring resonators. The intrinsic quality factors of single-mode ring resonators were in the range of = (4.7-5.7) × 10 corresponding to optical losses between 0.78 and 1.06 dB/cm. We then demonstrate the potential of this platform for future heterogeneous integration with ultralow-loss thin SiN and LiNbO platforms.
近年来,集成光子平台大量涌现,每个平台都展现出其独特的优势和不足。鉴于不同平台在加工方面的不兼容性,在集成光子学领域,要将不同光学材料的优势整合到一个混合集成平台上,仍然是一项艰巨的挑战。碳化硅因其高折射率、较强的二阶和三阶非线性以及在可见光和近红外范围内的宽透明窗口而备受关注。然而,集成碳化硅(SiC)一直很困难,目前的方法依赖于转移键合技术,这种技术既耗时又昂贵,而且层厚缺乏精度。在此,我们展示了在150°C下沉积的高折射率非晶碳化硅(a-SiC)薄膜,并通过制造标准光子波导和环形谐振器验证了该平台的高性能。单模环形谐振器的本征品质因数在 = (4.7 - 5.7) × 10范围内,对应于0.78至1.06 dB/cm的光学损耗。然后,我们展示了该平台未来与超低损耗薄SiN和LiNbO平台进行异质集成的潜力。