Li Lihua, Wang Ruiying, Huang Yingwei, Li Xingbang
Sino-German College of Intelligent Manufacturing, Shenzhen Technology University, Shenzhen 518118, China.
Micromachines (Basel). 2024 May 22;15(6):673. doi: 10.3390/mi15060673.
A novel non-isothermal glass hot embossing system utilizes a silicon mold core coated with a three-dimensional carbide-bonded graphene (CBG) coating, which acts as a thin-film resistance heater. The temperature of the system significantly influences the electrical conductivity properties of silicon with a CBG coating. Through simulations and experiments, it has been established that the electrical conductivity of silicon with a CBG coating gradually increases at lower temperatures and rapidly rises as the temperature further increases. The CBG coating predominantly affects electrical conductivity until 400 °C, after which silicon becomes the dominant factor. Furthermore, the dimensions of CBG-coated silicon and the reduction of CBG coating also affect the rate and outcome of conductivity changes. These findings provide valuable insights for detecting CBG-coated silicon during the embossing process, improving efficiency, and predicting the mold core's service life, thus enhancing the accuracy of optical lens production.
一种新型非等温玻璃热压花系统采用了涂覆有三维碳化物键合石墨烯（CBG）涂层的硅模具芯，该涂层用作薄膜电阻加热器。系统温度对涂有CBG涂层的硅的电导率特性有显著影响。通过模拟和实验发现，涂有CBG涂层的硅的电导率在较低温度下逐渐增加，随着温度进一步升高则迅速上升。CBG涂层在400°C之前对电导率起主要影响作用，之后硅成为主导因素。此外，涂有CBG涂层的硅的尺寸以及CBG涂层的减少也会影响电导率变化的速率和结果。这些发现为在压花过程中检测涂有CBG涂层的硅、提高效率以及预测模具芯的使用寿命提供了有价值的见解，从而提高了光学镜片生产的精度。
