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基于石英键角特性的蚀刻速率分析模型

Etching Rate Analysis Model Based on Quartz Bond Angle Characteristics.

作者信息

Zhao Xinjia, Lv Chengbao, Song Shuanqiang, Zhao Meng, Ji Jing

机构信息

Research Center for Applied Mechanics, School of Electro-Mechanical Engineering, Xidian University, No.2 South TaibaiRoad, Xi'an 710071, China.

Shaanxi Key Laboratory of Space Extreme Detection, Xi'an 710071, China.

出版信息

Micromachines (Basel). 2024 Jun 8;15(6):768. doi: 10.3390/mi15060768.

DOI:10.3390/mi15060768
PMID:38930737
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11205698/
Abstract

This paper proposes a method for classifying crystal planes based on the bond angle characteristics of quartz unit cells and constructs an etch rate model for quartz crystal planes at both macro and micro scales. By omitting oxygen atoms from the quartz cell structure, a method based on bond angle characteristics was established to partition the atomic arrangement of the crystal surface. This approach was used to analyze the etching processes of typical quartz crystal planes (R, r, m, and (0001)), approximating the etching process of crystals as a cyclic removal of certain bond angle characteristics on the crystal planes. This led to the development of an etch rate model based on micro-geometric parameters of crystal planes. Additionally, using the proposed bond angle classification method, the common characteristics of atomic configurations on the crystal plane surfaces within the X_cut type were extracted and classified into seven regions, further expanding and applying the etch rate model. The computational results of this model showed good agreement with experimental data, indicating the rationality and feasibility of the proposed method. These also provide a theoretical basis for understanding the microstructural changes during quartz-based MEMS etching processes.

摘要

本文提出了一种基于石英晶胞键角特征对晶面进行分类的方法,并构建了宏观和微观尺度下石英晶面的蚀刻速率模型。通过从石英晶胞结构中省略氧原子,建立了一种基于键角特征的方法来划分晶体表面的原子排列。该方法用于分析典型石英晶面(R、r、m和(0001))的蚀刻过程,将晶体的蚀刻过程近似为晶体平面上某些键角特征的循环去除。这导致了基于晶面微观几何参数的蚀刻速率模型的发展。此外,利用所提出的键角分类方法,提取了X切型内晶面表面原子构型的共同特征,并将其分为七个区域,进一步扩展和应用了蚀刻速率模型。该模型的计算结果与实验数据吻合良好,表明了所提方法的合理性和可行性。这些也为理解基于石英的微机电系统蚀刻过程中的微观结构变化提供了理论基础。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9f97/11205698/1fb065ba36c5/micromachines-15-00768-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9f97/11205698/b4fa88ac058d/micromachines-15-00768-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9f97/11205698/1dcf07159832/micromachines-15-00768-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9f97/11205698/e6037fba1d65/micromachines-15-00768-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9f97/11205698/7b92669a77dc/micromachines-15-00768-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9f97/11205698/f6dfc3262b04/micromachines-15-00768-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9f97/11205698/ec40e9c9c022/micromachines-15-00768-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9f97/11205698/1fb065ba36c5/micromachines-15-00768-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9f97/11205698/b4fa88ac058d/micromachines-15-00768-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9f97/11205698/1dcf07159832/micromachines-15-00768-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9f97/11205698/e6037fba1d65/micromachines-15-00768-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9f97/11205698/7b92669a77dc/micromachines-15-00768-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9f97/11205698/f6dfc3262b04/micromachines-15-00768-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9f97/11205698/ec40e9c9c022/micromachines-15-00768-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9f97/11205698/1fb065ba36c5/micromachines-15-00768-g008.jpg

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本文引用的文献

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Piezoelectric Micromachined Ultrasonic Transducers with Micro-Hole Inter-Etch and Sealing Process on (111) Silicon Wafer.采用微蚀刻和密封工艺在(111)硅片上制备的压电微机械超声换能器
Micromachines (Basel). 2024 Mar 30;15(4):482. doi: 10.3390/mi15040482.
2
Femtosecond laser-assisted fabrication of piezoelectrically actuated crystalline quartz-based MEMS resonators.基于飞秒激光辅助制造的压电驱动晶体石英微机电系统谐振器。
Microsyst Nanoeng. 2023 Mar 30;9:38. doi: 10.1038/s41378-023-00511-5. eCollection 2023.
3
A Fully Integrated Quartz MEMS VHF TCXO.
一款全集成石英微机电系统甚高频温补晶振。
IEEE Trans Ultrason Ferroelectr Freq Control. 2018 Jun;65(6):904-910. doi: 10.1109/TUFFC.2017.2786248.
4
Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer.基于石英微机电系统的振动梁加速度计的倒装芯片键合
Sensors (Basel). 2015 Sep 2;15(9):22049-59. doi: 10.3390/s150922049.