IEEE Trans Ultrason Ferroelectr Freq Control. 2018 Jun;65(6):904-910. doi: 10.1109/TUFFC.2017.2786248.
We report on a 32-MHz quartz temperature compensated crystal oscillator (TCXO) fully integrated with commercial CMOS electronics and vacuum packaged at wafer level using a low-temperature MEMS-after quartz process. The novel quartz resonator design provides for stress isolation from the CMOS substrate, thereby yielding classical AT-cut f/T profiles and low hysteresis which can be compensated to < ±0.2 parts per million over temperature using on-chip third-order compensation circuitry. The TCXO operates at low power of 2.5 mW and can be thinned to as part of the wafer-level eutectic encapsulation. Full integration with large state-of-the-art CMOS wafers is possible using carrier wafer techniques.
我们报告了一个 32MHz 的石英温度补偿晶体振荡器（TCXO），它完全与商业 CMOS 电子集成，并使用低温 MEMS 后石英工艺在晶圆级进行真空封装。新颖的石英谐振器设计提供了与 CMOS 衬底的应力隔离，从而产生经典的 AT 切 f/T 曲线和低滞后，使用片上三阶补偿电路可以将其补偿到温度变化 < ±0.2 百万分之一。TCXO 的工作功率低至 2.5mW，可以减薄到晶圆级共晶封装的一部分。使用载体晶圆技术可以与大型最先进的 CMOS 晶圆完全集成。
