Zarepour Atefeh, Rafati Nesa, Khosravi Arezoo, Rabiee Navid, Iravani Siavash, Zarrabi Ali
Department of Research Analytics, Saveetha Dental College and Hospitals, Saveetha Institute of Medical and Technical Sciences, Saveetha University Chennai 600 077 India.
Department of Nanobiotechnology, Faculty of Biological Science, Tarbiat Modares University Tehran Iran.
Nanoscale Adv. 2024 May 21;6(14):3513-3532. doi: 10.1039/d4na00239c. eCollection 2024 Jul 9.
MXenes, a class of two-dimensional materials, exhibit considerable potential in wound healing and dressing applications due to their distinctive attributes, including biocompatibility, expansive specific surface area, hydrophilicity, excellent electrical conductivity, unique mechanical properties, facile surface functionalization, and tunable band gaps. These materials serve as a foundation for the development of advanced wound healing materials, offering multifunctional nanoplatforms with theranostic capabilities. Key advantages of MXene-based materials in wound healing and dressings encompass potent antibacterial properties, hemostatic potential, pro-proliferative attributes, photothermal effects, and facilitation of cell growth. So far, different types of MXene-based materials have been introduced with improved features for wound healing and dressing applications. This review covers the recent advancements in MXene-based wound healing and dressings, with a focus on their contributions to tissue regeneration, infection control, anti-inflammation, photothermal effects, and targeted therapeutic delivery. We also discussed the constraints and prospects for the future application of these nanocomposites in the context of wound healing/dressings.
MXenes是一类二维材料,由于其独特的属性,包括生物相容性、大的比表面积、亲水性、优异的导电性、独特的机械性能、易于表面功能化以及可调节的带隙,在伤口愈合和敷料应用中展现出巨大潜力。这些材料为先进伤口愈合材料的开发奠定了基础,提供了具有治疗诊断能力的多功能纳米平台。基于MXene的材料在伤口愈合和敷料方面的关键优势包括强大的抗菌性能、止血潜力、促增殖属性、光热效应以及促进细胞生长。到目前为止,已经引入了不同类型的基于MXene的材料,其具有改进的特性用于伤口愈合和敷料应用。本综述涵盖了基于MXene的伤口愈合和敷料的最新进展,重点关注它们对组织再生、感染控制、抗炎、光热效应和靶向治疗递送的贡献。我们还讨论了这些纳米复合材料在伤口愈合/敷料背景下未来应用的限制和前景。