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热脱氢对非晶铟锡氧化锌薄膜晶体管正向偏置稳定性的影响

Thermal Dehydrogenation Impact on Positive Bias Stability of Amorphous InSnZnO Thin-Film Transistors.

作者信息

Lee Sein, Song Young-Woong, Park Jeong-Min, Lee Junseo, Ham Wooho, Song Min-Kyu, Namgung Seok Daniel, Shin Dongwook, Kwon Jang-Yeon

机构信息

School of Integrated Technology, Yonsei University, Seoul 03722, Republic of Korea.

BK21 Graduate Program in Intelligent Semiconductor Technology, Yonsei University, Incheon 21983, Republic of Korea.

出版信息

ACS Appl Mater Interfaces. 2024 Nov 6;16(44):61169-61178. doi: 10.1021/acsami.4c03689. Epub 2024 Jul 16.

Abstract

Recently, the growing demand for amorphous oxide semiconductor thin-film transistors (AOS TFTs) with high mobility and good stability to implement ultrahigh-resolution displays has made tracking the role of hydrogen in oxide semiconductor films increasingly important. Hydrogen is an essential element that contributes significantly to the field effect mobility and bias stability characteristics of AOS TFTs. However, because hydrogen is the lightest atom and has high reactivity to metal and oxide materials, elucidating its impact on AOS thin films has been challenging. Therefore, in this study, we propose controlling the hydrogen quantities in amorphous InSnZnO (a-ITZO) thin films through thermal dehydrogenation to precisely reveal the hydrogen influences on the electrical characteristics of a-ITZO TFTs. The as-deposited device containing 15.69 × 10 atoms/cm of hydrogen exhibited a relatively low saturation mobility of 18.1 cm/V·s and poor positive bias stress stability. However, depending on the extent of thermal dehydrogenation, not only did the hydrogen quantity and interface defect density () decrease but also the conductivity and surface energy increased due to the rise in oxygen vacancies and hydroxyl groups in a-ITZO thin films. As a result, the a-ITZO TFT with a hydrogen amount of 4.828 × 10 atoms/cm showed that the saturation mobility improved up to 36.8 cm/V·s, and positive bias stress stability was remarkably enhanced. Hence, we report the ability to manage the hydrogen quantity with thermal dehydrogenation and demonstrate that high-performance a-ITZO TFTs can be realized when an appropriate hydrogen concentration is achieved.

摘要

近年来,为实现超高分辨率显示器,对具有高迁移率和良好稳定性的非晶氧化物半导体薄膜晶体管(AOS TFT)的需求不断增长,这使得追踪氢在氧化物半导体薄膜中的作用变得越发重要。氢是一种关键元素,对AOS TFT的场效应迁移率和偏置稳定性特性有显著贡献。然而,由于氢是最轻的原子,且对金属和氧化物材料具有高反应性,阐明其对AOS薄膜的影响一直具有挑战性。因此,在本研究中,我们提出通过热脱氢来控制非晶铟锡锌氧化物(a-ITZO)薄膜中的氢含量,以精确揭示氢对a-ITZO TFT电学特性的影响。含有15.69×10个氢原子/立方厘米的沉积态器件表现出相对较低的饱和迁移率,为18.1厘米²/伏·秒,且正偏压应力稳定性较差。然而,根据热脱氢程度,a-ITZO薄膜中的氢含量和界面缺陷密度()不仅降低,而且由于氧空位和羟基的增加,电导率和表面能也增加。结果,氢含量为4.828×10个原子/立方厘米的a-ITZO TFT显示,饱和迁移率提高到36.8厘米²/伏·秒,正偏压应力稳定性显著增强。因此,我们报道了通过热脱氢管理氢含量的能力,并证明当达到适当的氢浓度时,可以实现高性能的a-ITZO TFT。

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