Liu Min, Zhang Xinyue, Zhang Shuxian, Pei Yanzhong
Interdisciplinary Materials Research Center, School of Materials Science and Engineering, Tongji Univ., 4800 Caoan Rd., Shanghai, 201804, China.
Nat Commun. 2024 Aug 3;15(1):6580. doi: 10.1038/s41467-024-50898-6.
For half a century, only BiTe-based thermoelectrics have been commercialized for near room temperature applications including both power generation and refrigeration. Because of the strong layered structure, BiTe in particular for n-type conduction has to be texturized to utilize its high in-plane thermoelectric performance, leaving a substantial challenge in toughness. This work presents the fabrication and performance evaluation of thermoelectric modules based on n-type AgSe paring with commercial p-BiTe. AgSe mechanically allows an order of magnitude larger fracture strain and thermoelectrically secures the module efficiency quite competitive to that of commercial one for both refrigeration and power generation within ± 50 K of room temperature, enabling a demonstration of a significantly tougher alternative to n-type BiTe for practical applications.
半个世纪以来，只有基于铋碲的热电材料在接近室温的应用（包括发电和制冷）中实现了商业化。由于其强烈的层状结构，特别是用于n型传导的铋碲必须进行织构化处理，以利用其高面内热电性能，但这在韧性方面带来了巨大挑战。这项工作展示了基于n型AgSe与商用p型BiTe配对的热电模块的制造和性能评估。AgSe在机械性能上允许一个数量级更大的断裂应变，并且在热电性能上确保模块效率在室温±50K范围内与商用模块相当，从而能够证明它是一种在实际应用中比n型BiTe韧性显著更高的替代材料。
