Bauyrzhan Maratuly, Azamatov Bagdat Nurlanovich, Jes Alexey Vladimirovich
East Kazakhstan Technical University, Competence center, Smart Engineering, Oskemen, Kazakhstan.
School of Digital Technologies and Artificial Intelligence, D. Serikbayev East Kazakhstan Technical University, Ust-Kamenogorsk, 070010, Kazakhstan.
Avicenna J Med Biotechnol. 2024 Jul-Sep;16(3):174-179. doi: 10.18502/ajmb.v16i3.15743.
The surface properties of the materials used significantly influence the success and longevity of medical implants. Increasing surface roughness promotes osteoblast activity and osseointegration, while biodegradable materials such as copper have shown potential for antimicrobial applications. However, the effect of coating parameters on surface topography is not well investigated.
Sputtering of copper was performed using EPOS-PVD-440 system (Zeleno-grad, Russia). The samples were examined by Scanning Electron Microscopy (SEM) with subsequent image processing in Mountains software (Digital Surf). Antibacterial efficacy was evaluated against Staphylococcus aureus by measuring the zone of inhibition. Additionally, copper ion release was monitored over time to assess its correlation with changes in surface topography.
Higher sputtering currents increased surface roughness and particle size, with a significant release of copper ions within the first 24 of immersion. Samples sputtered at higher currents exhibited coarser grain structures. The release of copper ions in the simulated biological environment led to further changes in surface topography, highlighting the critical influence of sputtering parameters on coating properties.
Optimizing magnetron copper deposition parameters enhances the surface topography and antibacterial effectiveness of biodegradable coatings on implants.
所用材料的表面特性对医用植入物的成功及使用寿命有显著影响。表面粗糙度增加可促进成骨细胞活性和骨整合,而诸如铜等可生物降解材料已显示出在抗菌应用方面的潜力。然而,涂层参数对表面形貌的影响尚未得到充分研究。
使用EPOS - PVD - 440系统(俄罗斯泽列诺格勒)进行铜溅射。通过扫描电子显微镜(SEM)对样品进行检查,并随后在Mountains软件(Digital Surf)中进行图像处理。通过测量抑菌圈评估对金黄色葡萄球菌的抗菌效果。此外,监测铜离子随时间的释放情况,以评估其与表面形貌变化的相关性。
较高的溅射电流增加了表面粗糙度和颗粒尺寸,在浸泡的前24小时内有大量铜离子释放。在较高电流下溅射的样品呈现出更粗糙的晶粒结构。在模拟生物环境中铜离子的释放导致表面形貌进一步变化,突出了溅射参数对涂层性能的关键影响。
优化磁控管铜沉积参数可增强植入物上可生物降解涂层的表面形貌和抗菌效果。