Wu Gui-Cheng, Lin Yong-Cheng, Wan Miao, Zeng Ning-Fu, Zhang Song, Zhang Hui-Jie, Chen Ming-Song, Jiang Yu-Qiang
School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China.
State Key Laboratory of Precision Manufacturing for Extreme Service Performance, Changsha 410083, China.
Materials (Basel). 2024 Aug 13;17(16):4026. doi: 10.3390/ma17164026.
Continuous dynamic recrystallization (CDRX) is widely acknowledged to occur during hot forming and plays a significant role in microstructure development in alloys with moderate to high stacking fault energy. In this work, the flow stress and CDRX behaviors of the TC18 alloy subjected to hot deformation across a wide range of processing conditions are studied. It is observed that deformation leads to the formation of new low-angle grain boundaries (LAGBs). Subgrains rotate by absorbing dislocations, resulting in an increase in LAGB misorientation and the transition of some LAGBs into high-angle grain boundaries (HAGBs). The HAGBs migrate within the material, assimilating the (sub)grain boundaries. Subsequently, an internal state variable (ISV)-based CDRX model is developed, incorporating parameters such as the dislocation density, adiabatic temperature rise, subgrain rotation, LAGB area, HAGB area, and LAGB misorientation angle distribution. The values of the correlation coefficient (R), relative average absolute error (RAAE), and root-mean-square error (RMSE) between the anticipated true stress and measured stress are 0.989, 6.69%, and 4.78 MPa, respectively. The predicted outcomes demonstrate good agreement with experimental findings. The evolving trends of the subgrain boundary area under various conditions are quantitatively analyzed by assessing the changes in dynamic recovery (DRV)-eliminated dislocations and misorientation angles. Moreover, the ISV-based model accurately predicts the decreases in grain and crystallite sizes with higher strain rates and lower temperatures. The projected outcomes also indicate a transition from a stable and coarse-grained microstructure to a continuously recrystallized substructure.
连续动态再结晶(CDRX)在热加工过程中广泛存在,并且在具有中等到高堆垛层错能的合金微观组织演变中发挥着重要作用。在这项工作中,研究了TC18合金在广泛加工条件下热变形时的流变应力和CDRX行为。观察到变形导致新的低角度晶界(LAGB)形成。亚晶粒通过吸收位错而旋转,导致LAGB取向差增加,并使一些LAGB转变为高角度晶界(HAGB)。HAGB在材料内部迁移,吞并(亚)晶界。随后,建立了基于内状态变量(ISV)的CDRX模型,该模型纳入了诸如位错密度、绝热温升、亚晶粒旋转、LAGB面积、HAGB面积和LAGB取向差角分布等参数。预测真应力与实测应力之间的相关系数(R)、相对平均绝对误差(RAAE)和均方根误差(RMSE)分别为0.989、6.69%和4.78MPa。预测结果与实验结果吻合良好。通过评估动态回复(DRV)消除的位错和取向差角的变化,定量分析了不同条件下亚晶界面积的演变趋势。此外,基于ISV的模型准确预测了较高应变速率和较低温度下晶粒和微晶尺寸的减小。预测结果还表明从稳定的粗晶微观结构向连续再结晶亚结构的转变。