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二氧化硅-聚合物异质混合集成马赫-曾德尔干涉仪光波导温度传感器

Silica-Polymer Heterogeneous Hybrid Integrated Mach-Zehnder Interferometer Optical Waveguide Temperature Sensor.

作者信息

Gao Zhanyu, Du Yuhang, Zhang Qizheng, Qin Yinxiang, Fang Jiongwen, Yi Yunji

机构信息

College of Integrated Circuits and Optoelectronic Chips, Shenzhen Technology University, Shenzhen 518118, China.

College of New Materials and New Energies, Shenzhen Technology University, Shenzhen 518118, China.

出版信息

Polymers (Basel). 2024 Aug 14;16(16):2297. doi: 10.3390/polym16162297.

Abstract

In this paper, a temperature sensor based on a polymer-silica heterogeneous integrated Mach-Zehnder interferometer (MZI) structure is proposed. The MZI structure consists of a polymer waveguide arm and a doped silica waveguide arm. Due to the opposite thermal optical coefficients of polymers and silica, the hybrid integrated MZI structure enhances the temperature sensing characteristics. The direct coupling method and side coupling method are introduced to reduce the coupling loss of the device. The simulation results show that the side coupling structure has lower coupling loss and greater manufacturing tolerance compared to the direct coupling structure. The side coupling loss for PMMA material-based devices, NOA material-based devices, and SU-8 material-based devices is 0.104 dB, 0.294 dB, and 0.618 dB, respectively. The sensitivity (S) values of the three hybrid devices are -6.85 nm/K, -6.48 nm/K, and -2.30 nm/K, which are an order of magnitude higher than those of an all-polymer waveguide temperature sensor. We calculated the temperature responsivity (R (FSR→∞) of the three devices as 13.16 × 10 K, 32.20 × 10 K, and 20.20 × 10 K, suggesting that high thermo-optic coefficient polymer materials and the hybrid integration method have a promising application in the field of on-chip temperature sensing.

摘要

本文提出了一种基于聚合物-二氧化硅异质集成马赫-曾德尔干涉仪(MZI)结构的温度传感器。该MZI结构由一个聚合物波导臂和一个掺杂二氧化硅波导臂组成。由于聚合物和二氧化硅的热光系数相反,混合集成MZI结构增强了温度传感特性。引入了直接耦合方法和侧面耦合方法以降低器件的耦合损耗。仿真结果表明,与直接耦合结构相比,侧面耦合结构具有更低的耦合损耗和更大的制造容差。基于PMMA材料的器件、基于NOA材料的器件和基于SU-8材料的器件的侧面耦合损耗分别为0.104 dB、0.294 dB和0.618 dB。这三种混合器件的灵敏度(S)值分别为-6.85 nm/K、-6.48 nm/K和-2.30 nm/K,比全聚合物波导温度传感器的灵敏度高一个数量级。我们计算出这三种器件的温度响应度(R(FSR→∞))分别为13.16×10 K、32.20×10 K和20.20×10 K,这表明高热光系数聚合物材料和混合集成方法在片上温度传感领域具有广阔的应用前景。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a931/11359350/79c9fc32adad/polymers-16-02297-g001.jpg

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