Wang Danqing, Xie Jiacheng, Guo Yu, Shen Mohan, Tang Hong X
Department of Electrical Engineering, Yale University, New Haven, CT, 06511, USA.
Microsyst Nanoeng. 2024 Sep 5;10(1):124. doi: 10.1038/s41378-024-00771-9.
The demand for high-performance electromechanical resonators is ever-growing across diverse applications, ranging from sensing and time-keeping to advanced communication devices. Among the electromechanical materials being explored, thin-film lithium niobate stands out due to its strong piezoelectric properties and low acoustic loss. However, in nearly all existing lithium niobate electromechanical devices, the configuration is such that the electrodes are in direct contact with the mechanical resonator. This configuration introduces an undesirable mass-loading effect, producing spurious modes and additional damping. Here, we present an electromechanical platform that mitigates this challenge by leveraging a flip-chip bonding technique to separate the electrodes from the mechanical resonator. By offloading the electrodes from the resonator, our approach yields a substantial increase in the quality factor of these resonators, paving the way for enhanced performance and reliability for their device applications.
对高性能机电谐振器的需求在各种应用中不断增长，从传感、计时到先进的通信设备。在正在探索的机电材料中，薄膜铌酸锂因其强大的压电特性和低声学损耗而脱颖而出。然而，在几乎所有现有的铌酸锂机电设备中，其结构都是使电极与机械谐振器直接接触。这种结构会引入不良的质量加载效应，产生杂散模式和额外的阻尼。在此，我们展示了一个机电平台，该平台通过利用倒装芯片键合技术将电极与机械谐振器分离来缓解这一挑战。通过将电极从谐振器上卸载，我们的方法使这些谐振器的品质因数大幅提高，为其器件应用的性能和可靠性提升铺平了道路。
