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用于本征可拉伸且可自愈的高迁移率聚合物半导体的原位连续氢键工程。

In situ continuous hydrogen-bonded engineering for intrinsically stretchable and healable high-mobility polymer semiconductors.

作者信息

Yue Haoguo, Wang Ying, Luo Shaochuan, Guo Junfeng, Jin Jun, Li Gongxi, Meng Zhihao, Zhang Lei, Zhou Dongshan, Zhen Yonggang, Hu Wenping

机构信息

Advanced Innovation Center for Soft Matter Science and Engineering, State Key Laboratory of Organic-Inorganic Composites, Beijing University of Chemical Technology, Beijing 100029, China.

Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China.

出版信息

Sci Adv. 2024 Oct 4;10(40):eadq0171. doi: 10.1126/sciadv.adq0171. Epub 2024 Oct 2.

Abstract

As a key component for wearable electronics, intrinsically stretchable and healable semiconducting polymers are scarce because carrier mobility is often reduced with increasing stretchability and self-healability. Here, we combine stepwise polymerization and thermal conversion to introduce in situ continuous hydrogen bonding sites in a polymer backbone without breaking the conjugation or introducing bulky softer side chains, benefiting the intrachain and interchain charge transport. We demonstrate that a regular sequence structure facilitated the formation of big nanofibers with a high degree of aggregation, providing the loose and porous thin film with simultaneously improved charge transport, stretchability, and self-healability. The mobility of damaged devices can be recovered to 81% after a healing treatment. Fully stretchable transistor based on the designed polymer exhibited a greatly enhanced mobility up to 1.08 square centimeters per volt per second under 100% strain, which is an unprecedented value and constitutes a major step for the development of intrinsically stretchable and healable semiconducting polymers.

摘要

作为可穿戴电子产品的关键组件,本征可拉伸且可自愈的半导体聚合物十分稀缺,因为载流子迁移率通常会随着拉伸性和自愈性的提高而降低。在此,我们将逐步聚合和热转化相结合,在聚合物主链中原位引入连续的氢键位点,而不破坏共轭结构或引入庞大的柔性侧链,这有利于链内和链间的电荷传输。我们证明,规则的序列结构促进了具有高度聚集性的大纳米纤维的形成,为疏松多孔薄膜同时提供了改善的电荷传输、拉伸性和自愈性。经过愈合处理后,受损器件的迁移率可恢复至81%。基于所设计聚合物的全可拉伸晶体管在100%应变下展现出高达1.08平方厘米每伏每秒的极大增强的迁移率,这是一个前所未有的值,也是本征可拉伸且可自愈的半导体聚合物发展的重要一步。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/442f/11446264/6943652ae1a1/sciadv.adq0171-f1.jpg

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