Influence of diode laser irradiation on microtensile bond strength of etch-and-rinse adhesive to dentin using two different etchants: An study.

AIM

The aim of this study was to evaluate the influence of 970 nm diode laser (DL) irradiation on the microtensile bond strength (TBS) of etch-and-rinse adhesive (ERA) to dentin using phosphoric acid (PA) or alpha-hydroxy glycolic acid (GA) as etchants.

MATERIALS AND METHODS

A total of 32 human third molars were selected and assigned randomly among two different groups and four subgroups based on etching protocols and DL irradiation: PA, PA-DL, GA, and GA-DL. After tooth preparation and subsequent incremental composite build-up, the samples were stored in distilled water for 24 h at 37°C. TBS values were obtained using the universal testing machine. The failure modes observed in dentin were categorized as adhesive, cohesive within dentin/resin, or mixed.

STATISTICAL ANALYSIS

The data were analyzed using one-way analysis of variance, followed by Tukey's test ( ≤ 0.001).

RESULTS

GA showed better or similar bond strength values to PA. Furthermore, irradiation of DL increased the TBS to dentin when both PA or GA are used as etchants.

CONCLUSION

GA can be used as an alternative etchant to PA. DL irradiation stands as a promising approach for elevating the performance of ERA adhesive systems to dentin.