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共封装光学研究进展

Progress in Research on Co-Packaged Optics.

作者信息

Tian Wenchao, Hou Huahua, Dang Haojie, Cao Xinxin, Li Dexin, Chen Si, Ma Bingxu

机构信息

School of Electro-Mechanical Engineering, Xidian University, Xi'an 710071, China.

State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xi'an 710071, China.

出版信息

Micromachines (Basel). 2024 Sep 29;15(10):1211. doi: 10.3390/mi15101211.

DOI:10.3390/mi15101211
PMID:39459085
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11509299/
Abstract

In the 5G era, the demand for high-bandwidth computing, transmission, and storage has led to the development of optoelectronic interconnect technology. This technology has evolved from traditional board-edge optical modules to smaller and more integrated solutions. Co-packaged optics (CPO) has evolved as a solution to meet the growing demand for data. Compared to typical optoelectronic connectivity technology, CPO presents distinct benefits in terms of bandwidth, size, weight, and power consumption. This study presents an overview of CPO, highlighting its fundamental principles, advantages, and distinctive features. Additionally, it examines the current research progress of two distinct approaches utilizing Vertical-Cavity Surface-Emitting Laser (VCSEL) and silicon photonics integration technology. Additionally, it provides a concise overview of the many application situations of CPO. Expanding on this, the analysis focuses on the CPO using 2D, 2.5D, and 3D packaging techniques. Lastly, taking into account the present technological environment, the scientific obstacles encountered by CPO are analyzed, and its future progress is predicted.

摘要

在5G时代，对高带宽计算、传输和存储的需求推动了光电互连技术的发展。这项技术已从传统的板边光模块发展到更小、更集成的解决方案。共封装光学（CPO）作为一种满足不断增长的数据需求的解决方案应运而生。与典型的光电连接技术相比，CPO在带宽、尺寸、重量和功耗方面具有明显优势。本研究概述了CPO，突出了其基本原理、优势和独特特征。此外，还研究了利用垂直腔面发射激光器（VCSEL）和硅光子集成技术的两种不同方法的当前研究进展。此外，还简要概述了CPO的多种应用场景。在此基础上，分析聚焦于采用2D、2.5D和3D封装技术的CPO。最后，考虑到当前的技术环境，分析了CPO面临的科学障碍，并预测了其未来的发展。

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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/b752/11509299/a222811f49cd/micromachines-15-01211-g017.jpg
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