Wu Senhan, Wen Song, He Huimin, Feng Jianyu, Chen Chuan, Xue Haiyun
State Key Laboratory of Fabrication Technologies for Integrated Circuits, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, 100029, China.
Front Optoelectron. 2025 May 14;18(1):11. doi: 10.1007/s12200-025-00156-4.
This study explores the application of cold plate liquid cooling technology in co-packaged optics (CPO). By integrating optical modules and the switch chip on the same substrate, CPO shortens the electrical interconnection distance, effectively solving the problems of high power consumption and poor signal integrity of traditional pluggable optical modules under high bandwidth. However, the surge in power density and the thermal crosstalk resulting from high integration density make thermal management one of the key challenges that constrain the reliability of high-capacity co-packaged optics. For the unique architecture of CPO, this study analyzes its heat dissipation needs in detail, and a thermal management scheme is designed. The thermal management scheme is simulated and optimized based on the Navier-Stokes equation. The simulation results show that, in a 51.2 Tbit/s CPO system, the junction temperature of the switch chip is 97.3 °C, the maximum junction temperature of the optical modules is 31.3 °C, and the temperature difference between the optical modules is 2.4 °C to 1.2 °C. To verify the simulation results, a thermal test experimental platform is built, and the experimental results show that the temperature simulation difference is within 4% and the pressure change trend is consistent with the simulation. Combining the experimental data and simulation results, the designed heat sink can satisfy the heat dissipation demands of the 51.2 Tbit/s bandwidth CPO system. This conclusion demonstrates the potential of liquid-cooling technology in CPO, providing support for research on liquid-cooling technology in the CPO. The design provides a theoretical and practical basis for the high performance and reliability of optoelectronic integration technology in wavelength division multiplexing (WDM) systems and micro-ring device applications, contributing to the application of next-generation optical communication networks.
本研究探讨了冷板液冷技术在共封装光学（CPO）中的应用。通过将光学模块和交换芯片集成在同一基板上，CPO缩短了电气互连距离，有效解决了传统可插拔光学模块在高带宽下功耗高和信号完整性差的问题。然而，高集成密度导致的功率密度激增和热串扰使热管理成为限制高容量共封装光学可靠性的关键挑战之一。针对CPO独特的架构，本研究详细分析了其散热需求，并设计了一种热管理方案。基于纳维-斯托克斯方程对热管理方案进行了模拟和优化。模拟结果表明，在51.2 Tbit/s的CPO系统中，交换芯片的结温为97.3°C，光学模块的最高结温为31.3°C，光学模块之间的温差为2.4°C至1.2°C。为了验证模拟结果，搭建了一个热测试实验平台，实验结果表明温度模拟差异在4%以内，压力变化趋势与模拟一致。结合实验数据和模拟结果，所设计的散热器能够满足51.2 Tbit/s带宽CPO系统的散热需求。这一结论证明了液冷技术在CPO中的潜力，为CPO中液冷技术的研究提供了支持。该设计为波分复用（WDM）系统和微环器件应用中的光电子集成技术的高性能和可靠性提供了理论和实践基础，有助于下一代光通信网络的应用。
