The Impact of Substrate Temperature on the Adhesion Strength of Electroplated Copper on an Al-Doped ZnO/Si System.

This research, which involved a comprehensive methodology, including depositing electroplated copper on a copper seed layer and Al-doped ZnO (AZO) thin films on textured silicon substrates using DC magnetron sputtering with varying substrate heating, has yielded significant findings. The study thoroughly investigated the effects of substrate temperature (Ts) on copper adhesion strength and morphology using the peel force test and electron microscopy. The peel force test was conducted at angles of 90°, 135°, and 180°. The average adhesion strength was about 0.2 N/mm for the samples without substrate heating. For the samples with substrate heating at 100 °C, the average peeling force of the electroplated copper film was about 1 N/mm. The average peeling force increased to 1.5 N/mm as the substrate heating temperature increased to 200 °C. The surface roughness increases as the annealing temperature of the Cu/AZO/Si sample increases. These findings not only provide a reliable and robust method for applying AZO transparent conductive films onto silicon solar cells but also underscore its potential to significantly enhance the efficiency and durability of solar cells significantly, thereby instilling confidence in the field of solar cell technology.