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在碳化硅衬底上生长的高功率氮化铝镓/氮化铟镓/氮化镓/氮化铝镓高电子迁移率晶体管的优化条件

Optimization Conditions for High-Power AlGaN/InGaN/GaN/AlGaN High-Electron-Mobility Transistor Grown on SiC Substrate.

作者信息

Kim Bonghwan, Park Seung-Hwan

机构信息

Department of Semiconductor Electronic Engineering, Daegu Catholic University, Gyeongsan 38430, Gyeongbuk, Republic of Korea.

出版信息

Materials (Basel). 2024 Nov 12;17(22):5515. doi: 10.3390/ma17225515.

Abstract

In this study, we aimed to propose an optimal structure for an AlGaN/InGaN/GaN/AlGaN/SiC HEMT by investigating how the breakdown voltage varies with the thickness and composition of the InGaN layer. The breakdown voltage was shown to be highly dependent on the In composition. Specifically, as the In composition increased, the breakdown voltage rapidly increased, but it exhibited saturation when the In composition exceeded 0.06. Therefore, it is desirable to maintain the In composition at or above 0.06. The variation in breakdown voltage due to thickness was relatively small compared to the variation caused by In composition. While the breakdown voltage remained nearly constant with increasing thickness, it began to decrease when the thickness exceeded 10 nm. Hence, the thickness should be kept below 10 nm. Additionally, as the In composition increased, the subthreshold swing (SS) also increased, but the drain current value was shown to increase. On the other hand, it was observed that the SS value in the transfer characteristics and the current-voltage characteristics were almost unaffected by the thickness of the InGaN layer.

摘要

在本研究中,我们旨在通过研究击穿电压如何随InGaN层的厚度和成分变化,为AlGaN/InGaN/GaN/AlGaN/SiC高电子迁移率晶体管提出一种优化结构。结果表明,击穿电压高度依赖于In成分。具体而言,随着In成分增加,击穿电压迅速升高,但当In成分超过0.06时呈现饱和。因此,将In成分保持在0.06或以上是理想的。与In成分引起的变化相比,厚度导致的击穿电压变化相对较小。虽然随着厚度增加击穿电压几乎保持恒定,但当厚度超过10 nm时它开始下降。因此,厚度应保持在10 nm以下。此外,随着In成分增加,亚阈值摆幅(SS)也增加,但漏极电流值显示出增加。另一方面,观察到InGaN层的厚度对转移特性和电流-电压特性中的SS值几乎没有影响。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ecc4/11595478/8c238d71c6fd/materials-17-05515-g001.jpg

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