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柔性离子电子传感

Flexible iontronic sensing.

作者信息

Li Yang, Bai Ningning, Chang Yu, Liu Zhiguang, Liu Jianwen, Li Xiaoqin, Yang Wenhao, Niu Hongsen, Wang Weidong, Wang Liu, Zhu Wenhao, Chen Di, Pan Tingrui, Guo Chuan Fei, Shen Guozhen

机构信息

School of Integrated Circuits, Shandong University, Jinan, 250101, China.

School of Mechano-Electronic Engineering, Xidian University, Xi'an, 710071, China.

出版信息

Chem Soc Rev. 2025 May 19;54(10):4651-4700. doi: 10.1039/d4cs00870g.

Abstract

The emerging flexible iontronic sensing (FITS) technology has introduced a novel modality for tactile perception, mimicking the topological structure of human skin while providing a viable strategy for seamless integration with biological systems. With research progress, FITS has evolved from focusing on performance optimization and structural enhancement to a new phase of integration and intelligence, positioning it as a promising candidate for next-generation wearable devices. Therefore, a review from the perspective of technological development trends is essential to fully understand the current state and future potential of FITS devices. In this review, we examine the latest advancements in FITS. We begin by examining the sensing mechanisms of FITS, summarizing research progress in material selection, structural design, and the fabrication of active and electrode layers, while also analysing the challenges and bottlenecks faced by different segments in this field. Next, integrated systems based on FITS devices are reviewed, highlighting their applications in human-machine interaction, healthcare, and environmental monitoring. Additionally, the integration of artificial intelligence into FITS is explored, focusing on optimizing front-end device design and improving the processing and utilization of back-end data. Finally, building on existing research, future challenges for FITS devices are identified and potential solutions are proposed.

摘要

新兴的柔性离子传感(FITS)技术为触觉感知引入了一种新的模式,它模仿人类皮肤的拓扑结构,同时为与生物系统的无缝集成提供了一种可行的策略。随着研究的进展,FITS已从专注于性能优化和结构增强发展到集成与智能的新阶段,使其成为下一代可穿戴设备的有前途的候选者。因此,从技术发展趋势的角度进行综述对于全面了解FITS设备的当前状态和未来潜力至关重要。在本综述中,我们研究了FITS的最新进展。我们首先研究FITS的传感机制,总结材料选择、结构设计以及有源层和电极层制造方面的研究进展,同时分析该领域不同环节面临的挑战和瓶颈。接下来,对基于FITS设备的集成系统进行综述,重点介绍它们在人机交互、医疗保健和环境监测中的应用。此外,还探讨了人工智能与FITS的集成,重点是优化前端设备设计以及改进后端数据的处理和利用。最后,基于现有研究,确定了FITS设备未来面临的挑战并提出了潜在的解决方案。

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