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采用间距为200μm的3D打印中介层的高频超声二维阵列设计与制造。

High frequency ultrasound 2D array design and fabrication with 3D printed interposers at 200 μm pitch.

作者信息

Sun Yizhe, Wodnicki Robert, Sun Xin, Kang Haochen, Liu Baoqiang, Lok U-Wai, Chen Shigao, Zhou Qifa

机构信息

Department of Biomedical Engineering, Viterbi School of Engineering, University of Southern California, Los Angeles, CA 90089, USA.

Department of Biomedical Engineering, Viterbi School of Engineering, University of Southern California, Los Angeles, CA 90089, USA; Roski Eye Institute, Keck School of Medicine, University of Southern California, Los Angeles, CA 90033, USA.

出版信息

Ultrasonics. 2025 Oct;154:107674. doi: 10.1016/j.ultras.2025.107674. Epub 2025 May 2.

Abstract

High-frequency 2D ultrasound arrays (10-50 MHz) can adjust the focus position in three-dimensional space to produce highly focused beams and have potential use in ultrasound elastography and ophthalmology applications. However, these applications remain unfulfilled due to the difficulty in realizing the array element pitch requirements of high-frequency ultrasound 2D arrays with existing technologies. In recent years, the rapid development of 3D printing technology has made complex and fine structures possible. By utilizing high-resolution 3D printing technology, we can effectively solve the connection problem between circuits and acoustic modules in the ultrasound 2D array fabrication process, making it possible to fabricate high-frequency ultrasound 2D arrays. In this work, we demonstrate two alternative fabrication processes for high-frequency 2D ultrasound arrays with a realized pitch of 200 µm and 256 elements per array. The fabricated arrays achieved a yield of 82 % and 75 %, with an average fractional bandwidth of 43 %. The element-to-element variability in bandwidth was 18 %, which reflects the inherent challenges of fine-pitch high-frequency array fabrication. These results highlight the feasibility of scalable fabrication techniques while identifying areas for future optimization.

摘要

高频二维超声阵列(10 - 50兆赫兹)能够在三维空间中调整聚焦位置以产生高度聚焦的波束,在超声弹性成像和眼科应用中具有潜在用途。然而,由于现有技术难以满足高频超声二维阵列的阵元间距要求,这些应用尚未实现。近年来,3D打印技术的快速发展使复杂精细结构成为可能。通过利用高分辨率3D打印技术,我们能够有效解决超声二维阵列制造过程中电路与声学模块之间的连接问题,从而实现高频超声二维阵列的制造。在这项工作中,我们展示了两种用于高频二维超声阵列的替代制造工艺,所实现的阵元间距为200微米,每个阵列有256个阵元。制造出的阵列良品率分别为82%和75%,平均分数带宽为43%。带宽方面的阵元间差异为18%,这反映了细间距高频阵列制造所固有的挑战。这些结果凸显了可扩展制造技术的可行性,同时也指出了未来优化的方向。

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