Konieczny Jarosław, Labisz Krzysztof, Ürgün Satılmış, Yiğit Halil, Fidan Sinan, Bora Mustafa Özgür, Atapek Şaban Hakan, Ćwiek Janusz
Department of Railway Transport, Faculty of Transport and Aviation Engineering, Silesian University of Technology, Krsińskiego 8 Street, 40-019 Katowice, Poland.
Faculty of Aviation and Astronautics, Aviation Electrical Electronics, Kocaeli University, İzmit 41001, Kocaeli, Türkiye.
Materials (Basel). 2025 May 19;18(10):2366. doi: 10.3390/ma18102366.
This study focuses on cold deformation and age effects on the microhardness and electric conductivity of the Cu-4Ti (wt.%) alloys. The samples were solution treated at 900 °C, quenched in water, and aged at 450-600 °C for 1-120 min. Fifty percent cold rolling was performed before aging to analyze the impact on their microstructure and properties. Hardness and electric conductivity were examined by the Vickers microhardness and Förster testing. Hardness increased significantly while electric conductivity was maintained. The optimal hardness of 298 HV appeared following 50% cold rolling and aging for 120 min at 450 °C, and an electric conductivity of 9.4 MS/m was achieved after 120 min at 600 °C in cold-rolled materials. The deformed and solution-treated materials reached 244 HV after 120 min at 500 °C, and electric conductivity reached 7.7 MS/m. Polynomial models of regression were used to analyze the impact of aging parameters on properties. Process parameters were properly optimized by applying metaheuristic algorithms. These contributions ensure a better understanding of the relationship between the microstructure and properties in Cu-Ti alloys, as well as their application in aircraft and electronics.
本研究聚焦于冷变形和时效对Cu-4Ti(重量百分比)合金显微硬度和电导率的影响。样品在900℃进行固溶处理,水冷淬火,并在450 - 600℃时效1 - 120分钟。在时效前进行50%的冷轧,以分析其对微观结构和性能的影响。通过维氏显微硬度测试和福斯特测试来检测硬度和电导率。硬度显著增加而电导率保持不变。在50%冷轧并于450℃时效120分钟后,出现了298 HV的最佳硬度,在600℃时效120分钟后,冷轧材料的电导率达到9.4 MS/m。经过120分钟在500℃时效后,变形和固溶处理的材料硬度达到244 HV,电导率达到7.7 MS/m。使用多项式回归模型来分析时效参数对性能的影响。通过应用元启发式算法对工艺参数进行了适当优化。这些成果有助于更好地理解Cu-Ti合金微观结构与性能之间的关系,以及它们在航空航天和电子领域的应用。