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基于绝缘体的介电电泳用于纯化与半导体工业兼容的含痕量纳米颗粒的化学品。

Insulator-Based Dielectrophoresis for Purifying Semiconductor Industry-Compatible Chemicals with Trace Nanoparticles.

作者信息

Lee Donggyu, Lee Seungyun, Jang Jinhyeok, Oh Jun Young, Kim Younghun, Choi Sam-Jong, Kim Yun Ho, Kim Jihyun

机构信息

Department of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea.

Material Technology Team, Common Technology Center, DS, Samsung Electronics, Suwon, Gyeonggi-do 17786, Republic of Korea.

出版信息

JACS Au. 2025 May 15;5(5):2342-2349. doi: 10.1021/jacsau.5c00307. eCollection 2025 May 26.

DOI:10.1021/jacsau.5c00307
PMID:40443887
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC12117461/
Abstract

As semiconductor scaling advances below 2-3 nm dimensions, precise control of nanoscale impurities becomes crucial for maintaining device performance and production yield. Conventional purification methods, such as distillation and filtration, are ineffective in removing nanoparticles smaller than 10 nm. This study investigates insulator-based dielectrophoresis (iDEP) for efficient removal of silica nanoparticles from semiconductor processing chemicals. Interdigitated electrode patterns fabricated on sapphire substrates were employed to generate high electric field gradients, facilitating nanoparticle aggregation. A 20 nm-thick aluminum oxide passivation layer was deposited via atomic layer deposition to prevent electrode degradation. Finite element method simulations confirmed that the strong electric field gradient necessary for nanoparticle aggregation was generated at the electrode edges. The optimal frequency for nanoparticle aggregation was determined using the Clausius-Mossotti factor, and large-scale iDEP experiments demonstrated a 41.3% reduction in Si concentration in deionized water and a 23.4% reduction in 2% nitric acid after 12 purification cycles. This method effectively removes the nanoparticles that are difficult to eliminate using conventional techniques, enhancing the purity of semiconductor processing chemicals. The study demonstrates iDEP's scalability, high throughput, and reliability for industrial applications, offering a promising solution for meeting purity standards in semiconductor fabrication.

摘要

随着半导体尺寸缩小至2-3纳米以下,精确控制纳米级杂质对于维持器件性能和生产良率至关重要。传统的纯化方法,如蒸馏和过滤,在去除小于10纳米的纳米颗粒方面效果不佳。本研究探讨基于绝缘体的介电电泳(iDEP)技术,以有效去除半导体加工化学品中的二氧化硅纳米颗粒。在蓝宝石衬底上制作的叉指电极图案用于产生高电场梯度,促进纳米颗粒聚集。通过原子层沉积法沉积了一层20纳米厚的氧化铝钝化层,以防止电极退化。有限元方法模拟证实,在电极边缘产生了纳米颗粒聚集所需的强电场梯度。利用克劳修斯-莫索蒂因子确定了纳米颗粒聚集的最佳频率,大规模iDEP实验表明,经过12个纯化循环后,去离子水中的硅浓度降低了41.3%,2%硝酸中的硅浓度降低了23.4%。该方法有效去除了传统技术难以去除的纳米颗粒,提高了半导体加工化学品的纯度。该研究证明了iDEP在工业应用中的可扩展性、高通量和可靠性,为满足半导体制造中的纯度标准提供了一个有前景的解决方案。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6b0d/12117461/281fd091f369/au5c00307_0005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6b0d/12117461/ae0a5f9bf6d3/au5c00307_0001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6b0d/12117461/bfc127ba50a2/au5c00307_0002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6b0d/12117461/c91edfa93689/au5c00307_0003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6b0d/12117461/a2d6d2120c02/au5c00307_0004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6b0d/12117461/281fd091f369/au5c00307_0005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6b0d/12117461/ae0a5f9bf6d3/au5c00307_0001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6b0d/12117461/bfc127ba50a2/au5c00307_0002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6b0d/12117461/c91edfa93689/au5c00307_0003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6b0d/12117461/a2d6d2120c02/au5c00307_0004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6b0d/12117461/281fd091f369/au5c00307_0005.jpg

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Precise Nanoparticle Manipulation Using Femtosecond Laser Trapping.利用飞秒激光捕获进行精确的纳米颗粒操控。
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