Zhang Guangming, Yu Zhihao, Song Daosen, Fu Zhiguo, Zhu Xiaoyang, Li Hongke, Duan Peikai, Qian Lei, Zhao Jiawei, Xu Quan, He Jiankang, Li Dichen, Lan Hongbo
Shandong Engineering Research Center for Additive Manufacturing, Qingdao University of Technology, Qingdao, China.
Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Hong Kong, China.
Nat Commun. 2025 Jun 6;16(1):5258. doi: 10.1038/s41467-025-60408-x.
Ceramic circuit boards (CCBs) have been extensively utilized in 5G communications, aerospace, and artificial intelligence due to their excellent thermal conductivity and electrical performance. However, due to the limitation of manufacturing technologies, the existing CCBs can not take into account both the resolution and thickness, which restricts the miniaturization and high power of the resulting electronics. Herein, we report a standing-CCBs (S-CCBs) with both high-resolution and high aspect-ratio fabricated via sacrificial coating-assisted micro-3D printing. Benefiting from this technique, S-CCBs can be easily printed as a tall and thin-walled structure without landslides and sintered to be highly conductive wire with an overall shrinkage on the rough ceramic substrates, achieving a line width of 7 µm and aspect-ratio of 2.3 on various ceramic substrates (AlO, AlN, and ZrO) with conductivity of 5.1 × 10 S m. Such circuits also possess environmental compatibility under mechanical tests (1000 adhesion test and scratch test) and harsh environments (500 °C aging for 500 h and chemical attack for 500 h). The proposed technique free from traditional lithography, etching, and plating processes opens up a promising strategy of implementing both high-density integration and large current-carrying capacity.
陶瓷电路板（CCBs）因其优异的导热性和电气性能，已在5G通信、航空航天和人工智能领域得到广泛应用。然而，由于制造技术的限制，现有的CCBs无法兼顾分辨率和厚度，这限制了由此产生的电子产品的小型化和高功率化。在此，我们报道了一种通过牺牲涂层辅助微3D打印制造的具有高分辨率和高纵横比的立式CCBs（S-CCBs）。受益于该技术，S-CCBs可以轻松打印成高且薄壁的结构而不会出现滑坡，并在粗糙的陶瓷基板上烧结成高导电线路，在各种陶瓷基板（AlO、AlN和ZrO）上实现了7 µm的线宽和2.3的纵横比，电导率为5.1×10 S m。这种电路在机械测试（1000次附着力测试和划痕测试）和恶劣环境（500 °C老化500 h和化学侵蚀500 h）下也具有环境兼容性。所提出的技术无需传统的光刻、蚀刻和电镀工艺，为实现高密度集成和大载流能力开辟了一条有前景的策略。
