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用于数据和模型驱动工艺设计的钇钡铜氧超导薄膜集成工艺-性能建模

Integrated process-property modeling of YBaCuO superconducting film for data and model driven process design.

作者信息

Horide Tomoya, Okumura Shin, Ito Shunta, Yoshida Yutaka

机构信息

Department of Electrical Engineering, Nagoya University, Furo-cho, Chikusa, Nagoya, Japan.

出版信息

Commun Eng. 2025 Jun 23;4(1):114. doi: 10.1038/s44172-025-00434-1.

DOI:10.1038/s44172-025-00434-1
PMID:40550855
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC12185723/
Abstract

Process engineering of materials determines not only materials properties, but also cost, yield and production capacity. Although process design is generally based on the experience of process engineers, mathematical/data-science modeling is a key challenge for future process optimization. Here we create new opportunities for process optimization in YBaCuO film fabrication through data/model-driven process design. We show integrated modelling of substrate temperature and critical current density in YBaCuO films. Gaussian process regression augmented by transfer learning and physics knowledge was constructed from a small amount of data to show substrate temperature dependence of critical current density. Non-numerical factors such as chamber design and substrate material were included in the transfer learning, and physics-aided techniques extended the model to different magnetic fields. Magnetic field dependence of critical current density was successfully predicted for a given substrate temperature for a five-sample series deposited using different pulsed laser deposition systems. Our integrated process and property modelling strategy enables data/model-driven process design for YBaCuO film fabrication for coated conductor applications.

摘要

材料的工艺工程不仅决定材料性能,还决定成本、产量和生产能力。虽然工艺设计通常基于工艺工程师的经验,但数学/数据科学建模是未来工艺优化的关键挑战。在此,我们通过数据/模型驱动的工艺设计为钇钡铜氧(YBaCuO)薄膜制造中的工艺优化创造了新机会。我们展示了YBaCuO薄膜中衬底温度和临界电流密度的集成建模。通过迁移学习和物理知识增强的高斯过程回归,利用少量数据构建模型,以显示临界电流密度对衬底温度的依赖性。迁移学习纳入了腔室设计和衬底材料等非数值因素,物理辅助技术将模型扩展到不同磁场。对于使用不同脉冲激光沉积系统沉积的五组样品系列,成功预测了给定衬底温度下临界电流密度的磁场依赖性。我们的集成工艺和性能建模策略实现了用于涂层导体应用的YBaCuO薄膜制造的数据/模型驱动工艺设计。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/e51ad6fb69e0/44172_2025_434_Fig9_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/16d067bd9485/44172_2025_434_Fig1_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/968e36f9cfb2/44172_2025_434_Fig2_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/fb3dbe0e49f0/44172_2025_434_Fig3_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/61f1ed1388cc/44172_2025_434_Fig4_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/293d2f7b84b6/44172_2025_434_Fig5_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/9e7755de13b7/44172_2025_434_Fig6_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/11f304a6a872/44172_2025_434_Fig7_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/1539e897d856/44172_2025_434_Fig8_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/e51ad6fb69e0/44172_2025_434_Fig9_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/16d067bd9485/44172_2025_434_Fig1_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/968e36f9cfb2/44172_2025_434_Fig2_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/fb3dbe0e49f0/44172_2025_434_Fig3_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/61f1ed1388cc/44172_2025_434_Fig4_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/293d2f7b84b6/44172_2025_434_Fig5_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/9e7755de13b7/44172_2025_434_Fig6_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/11f304a6a872/44172_2025_434_Fig7_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/1539e897d856/44172_2025_434_Fig8_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/636e/12185723/e51ad6fb69e0/44172_2025_434_Fig9_HTML.jpg

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