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一种基于串联二维晶体管中负跨导的多值逻辑门通用实现方法。

A Universal Implementation Approach for Multivalued Logic Gates Based on Negative Transconductance in Series-Connected Two-Dimensional Transistors.

作者信息

Zhao Guangchao, Wen Wanting, Liao Keyi, Coquet Philippe, Wang Xingli, Huang Mingqiang, Tay Beng Kang

机构信息

IRL 3288 CINTRA (CNRS/NTU/Thales), Nanyang Technological University, Singapore 637457, Singapore.

Centre for Micro-&Nano-Electronics, School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 637457, Singapore.

出版信息

ACS Nano. 2025 Jul 15;19(27):24961-24971. doi: 10.1021/acsnano.5c04182. Epub 2025 Jun 30.

Abstract

Multiple-valued logic (MVL) is highly desired for algebra, logic, and artificial intelligence due to its higher information density. However, its practical adoption has been hindered for decades by extensive hardware requirements. Two-dimensional (2D) materials with exceptional electronic properties provide possibilities for the development of MVL devices with simple structures. Despite several reports on ternary logic ( = 3) hardware, extending their design to higher logic radix devices ( > 3) is challenging. The construction of elementary MVL gates with a higher radix is still relatively underexplored, and a universal device implementation approach is lacking. In this study, we exploit transconductance () matching between the negative transconductance (NTC) effect in series-connected molybdenum disulfide (MoS) and black phosphorus (BP) transistors, along with the multiple current valleys of BP transistors, to realize a series of multivalued logic (MVL) gate families ( = 3, 4, 5). Our design achieves reduced transistor counts, higher DC gains, and lower power consumption. Standard quaternary ( = 4) and quinary ( = 5) inverters are demonstrated using only four and five planar transistors, respectively. Additionally, compact models of 2D transistors and equivalent circuits of the MVL gate are established, supporting future large-scale MVL system design and simulation.

摘要

由于其更高的信息密度,多值逻辑(MVL)在代数、逻辑和人工智能领域备受青睐。然而,几十年来,其实际应用一直受到大量硬件需求的阻碍。具有卓越电子特性的二维(2D)材料为开发结构简单的MVL器件提供了可能性。尽管已有多篇关于三值逻辑(= 3)硬件的报道,但将其设计扩展到更高逻辑基数的器件(> 3)仍具有挑战性。更高基数的基本MVL门的构建仍相对未得到充分探索,并且缺乏通用的器件实现方法。在本研究中,我们利用串联的二硫化钼(MoS)和黑磷(BP)晶体管中的负跨导(NTC)效应之间的跨导()匹配,以及BP晶体管的多个电流谷,来实现一系列多值逻辑(MVL)门族(= 3、4、5)。我们的设计实现了晶体管数量减少、更高的直流增益和更低的功耗。标准四值(= 4)和五值(= 5)反相器分别仅使用四个和五个平面晶体管即可实现。此外,还建立了二维晶体管的紧凑模型和MVL门的等效电路,为未来大规模MVL系统的设计和仿真提供了支持。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2ed7/12269348/4045053e54cc/nn5c04182_0001.jpg

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