Cai Zimo, Ye Kangjie, Luo Huayu, Tang Jian, Yang Geng, Xie Haibo, Yang Huayong, Xu Kaichen
State Key Laboratory of Fluid Power & Mechatronic Systems, School of Mechanical Engineering, Zhejiang University, Hangzhou 310058, China.
Institute of Advanced Machines, Zhejiang University, Hangzhou 311106, China.
Research (Wash D C). 2025 Jul 24;8:0779. doi: 10.34133/research.0779. eCollection 2025.
Textiles with intrinsic breathability and mechanical adaptability are revolutionizing wearable electronics by delivering outstanding comfort and integration potentials. However, the expanding functionalities and body coverage of textile electronics necessitate large-scale and distributed driving circuits, which typically compromise the flexibility and permeability of textiles. To overcome the limitations of traditional circuit boards, textile hybrid electronics (THE) have emerged as promising electronic platforms, where both flexible and rigid components are seamlessly integrated into textiles. This route offers a synergy of system-level performance and wearing comfort. The progress report presents a comprehensive overview of the fabrication strategies for fully integrated THE, mainly encompassing the cross-scale production of flexible components and the reliable integration of rigid components. First, typical materials classified in textile electronic components are summarized. Then, various methods for constructing flexible coatings and fibrous structures are elucidated with distinct mechanisms and advantages for textile substrates. Followed by that, the focus shifts to the heterogeneous integration of rigid components, including the layer-by-layer and in-fiber strategies. Both approaches show promise in realizing monolithic and untethered THE systems. Furthermore, representative paradigms of THE are presented for their applications in pervasive health management and human-machine interaction. Finally, future trends of THE toward distributed and intelligent systems are specially emphasized, with key challenges and potential solutions outlined. The combination of various forms of THE is expected to embed advanced electronic functionalities into everyday textiles, bridging the gap between wearable electronics and human life.
具有内在透气性和机械适应性的纺织品正在彻底改变可穿戴电子产品，为人们带来卓越的舒适度和集成潜力。然而，随着纺织电子产品功能的不断扩展和身体覆盖范围的扩大，需要大规模的分布式驱动电路，这通常会损害纺织品的柔韧性和透气性。为了克服传统电路板的局限性，纺织混合电子（THE）作为一种有前途的电子平台应运而生，其中柔性和刚性组件都能无缝集成到纺织品中。这种方法实现了系统级性能与穿着舒适度的协同。本进展报告全面概述了全集成THE的制造策略，主要包括柔性组件的跨尺度生产和刚性组件的可靠集成。首先，总结了纺织电子组件中典型的材料。然后，阐述了构建柔性涂层和纤维结构的各种方法，这些方法对纺织基材具有不同的机制和优势。随后，重点转向刚性组件的异质集成，包括逐层和纤维内策略。这两种方法在实现单片式和无束缚的THE系统方面都很有前景。此外，还介绍了THE在普及健康管理和人机交互中的代表性应用范例。最后，特别强调了THE向分布式和智能系统发展的未来趋势，并概述了关键挑战和潜在解决方案。预计各种形式的THE相结合，能够将先进的电子功能嵌入日常纺织品中，弥合可穿戴电子产品与人类生活之间的差距。
