Textiles with intrinsic breathability and mechanical adaptability are revolutionizing wearable electronics by delivering outstanding comfort and integration potentials. However, the expanding functionalities and body coverage of textile electronics necessitate large-scale and distributed driving circuits, which typically compromise the flexibility and permeability of textiles. To overcome the limitations of traditional circuit boards, textile hybrid electronics (THE) have emerged as promising electronic platforms, where both flexible and rigid components are seamlessly integrated into textiles. This route offers a synergy of system-level performance and wearing comfort. The progress report presents a comprehensive overview of the fabrication strategies for fully integrated THE, mainly encompassing the cross-scale production of flexible components and the reliable integration of rigid components. First, typical materials classified in textile electronic components are summarized. Then, various methods for constructing flexible coatings and fibrous structures are elucidated with distinct mechanisms and advantages for textile substrates. Followed by that, the focus shifts to the heterogeneous integration of rigid components, including the layer-by-layer and in-fiber strategies. Both approaches show promise in realizing monolithic and untethered THE systems. Furthermore, representative paradigms of THE are presented for their applications in pervasive health management and human-machine interaction. Finally, future trends of THE toward distributed and intelligent systems are specially emphasized, with key challenges and potential solutions outlined. The combination of various forms of THE is expected to embed advanced electronic functionalities into everyday textiles, bridging the gap between wearable electronics and human life.