Zeng Yanan, Miao Xiangkan, Wang Yajun, Yuan Yukang, Ge Bingbing, Li Lanjie, Wu Kanghua, Li Junguo, Wang Yitong
School of Metallurgy and Energy Engineering, North China University of Science and Technology, Tangshan 063210, China.
HBIS Material Technology Research Institute, Shijiazhuang 050023, China.
Materials (Basel). 2025 Aug 18;18(16):3865. doi: 10.3390/ma18163865.
The microcrack initiation and evolution behavior of Fe-C alloy under uniaxial tensile loading are investigated using molecular dynamics (MD) simulations. The model is stretched along the -axis at a strain rate of 2 × 10 s and temperatures ranging from 300 to 1100 K, aiming to elucidate the microscopic deformation mechanisms during crack evolution under varying thermal conditions. The results indicate that the yield strength of Fe-C alloy decreases with a rising temperature, accompanied by a 25.2% reduction in peak stress. Within the temperature range of 300-700 K, stress-strain curves exhibit a dual-peak trend: the first peak arises from stress-induced transformations in the internal crystal structure, while the second peak corresponds to void nucleation and growth. At 900-1100 K, stress curves display a single-peak pattern, followed by rapid stress decline due to accelerated void coalescence. Structural evolution analysis reveals sequential phase transitions: initial BCC-to-FCC and -HCP transformations occur during deformation, followed by reversion to BCC and unidentified structures post-crack formation. Elevated temperatures enhance atomic mobility, increasing the proportion of disordered/unknown structures and accelerating material failure. Higher temperatures promote faster potential energy equilibration, primarily through accelerated void growth, which drives rapid energy dissipation.
采用分子动力学(MD)模拟研究了Fe-C合金在单轴拉伸载荷下的微裂纹萌生和扩展行为。该模型沿x轴以2×10 s的应变速率和300至1100 K的温度进行拉伸,旨在阐明不同热条件下裂纹扩展过程中的微观变形机制。结果表明,Fe-C合金的屈服强度随温度升高而降低,峰值应力降低了25.2%。在300-700 K温度范围内,应力-应变曲线呈现双峰趋势:第一个峰值源于内部晶体结构的应力诱导转变,而第二个峰值对应于空洞形核和生长。在900-1100 K时,应力曲线呈现单峰模式,随后由于空洞合并加速导致应力迅速下降。结构演化分析揭示了连续的相变:变形过程中最初发生BCC到FCC和HCP转变,裂纹形成后再转变回BCC和未识别结构。温度升高会增强原子迁移率,增加无序/未知结构的比例并加速材料失效。较高温度促进势能更快地平衡,主要通过加速空洞生长来实现,这会驱动快速的能量耗散。