Rogers J A, Bao Z, Baldwin K, Dodabalapur A, Crone B, Raju V R, Kuck V, Katz H, Amundson K, Ewing J, Drzaic P
Bell Laboratories, Lucent Technologies, 600 Mountain Avenue, Murray Hill, NJ 07974, USA.
Proc Natl Acad Sci U S A. 2001 Apr 24;98(9):4835-40. doi: 10.1073/pnas.091588098.
Electronic systems that use rugged lightweight plastics potentially offer attractive characteristics (low-cost processing, mechanical flexibility, large area coverage, etc.) that are not easily achieved with established silicon technologies. This paper summarizes work that demonstrates many of these characteristics in a realistic system: organic active matrix backplane circuits (256 transistors) for large ( approximately 5 x 5-inch) mechanically flexible sheets of electronic paper, an emerging type of display. The success of this effort relies on new or improved processing techniques and materials for plastic electronics, including methods for (i) rubber stamping (microcontact printing) high-resolution ( approximately 1 microm) circuits with low levels of defects and good registration over large areas, (ii) achieving low leakage with thin dielectrics deposited onto surfaces with relief, (iii) constructing high-performance organic transistors with bottom contact geometries, (iv) encapsulating these transistors, (v) depositing, in a repeatable way, organic semiconductors with uniform electrical characteristics over large areas, and (vi) low-temperature ( approximately 100 degrees C) annealing to increase the on/off ratios of the transistors and to improve the uniformity of their characteristics. The sophistication and flexibility of the patterning procedures, high level of integration on plastic substrates, large area coverage, and good performance of the transistors are all important features of this work. We successfully integrate these circuits with microencapsulated electrophoretic "inks" to form sheets of electronic paper.
使用坚固轻质塑料的电子系统可能具有一些吸引人的特性（低成本加工、机械柔韧性、大面积覆盖等），而这些特性是传统硅技术难以实现的。本文总结了在一个实际系统中展示这些特性的许多工作：用于大型（约5×5英寸）机械柔性电子纸张的有机有源矩阵背板电路（256个晶体管），这是一种新兴的显示类型。这项工作的成功依赖于用于塑料电子学的新的或改进的加工技术和材料，包括以下方法：（i）通过橡胶压印（微接触印刷）制作具有低缺陷水平且在大面积上具有良好对准性的高分辨率（约1微米）电路；（ii）在有浮雕的表面上沉积薄电介质以实现低泄漏；（iii）构建具有底部接触几何结构的高性能有机晶体管；（iv）封装这些晶体管；（v）以可重复的方式在大面积上沉积具有均匀电学特性的有机半导体；以及（vi）低温（约100摄氏度）退火以提高晶体管的开/关比并改善其特性的均匀性。图案化工艺的复杂性和灵活性、塑料基板上的高集成度、大面积覆盖以及晶体管的良好性能都是这项工作的重要特征。我们成功地将这些电路与微胶囊化的电泳“墨水”集成在一起，形成了电子纸张。
