Mayr W, Bijak M, Rafolt D, Sauermann S, Unger E, Lanmüller H
Department of Biomedical Engineering and Physics, Vienna University Medical School, AKH, Währinger Gürtel 18-20, 4/L, A-1090, Vienna, Austria.
Med Eng Phys. 2001 Jan;23(1):53-60. doi: 10.1016/s1350-4533(01)00014-5.
We can distinguish 3 generations of FES implants for activation of neural structures: 1. RF-powered implants with antenna displacement dependent stimulation amplitude; 2. RF-powered implants with stabilised stimulation amplitude; and 3. battery powered implants. In Vienna an 8-channel version of the second generation type has been applied clinically to mobilisation of paraplegics and phrenic pacing. A 20-channel implant of the second generation type for mobilisation of paraplegics and an 8-channel implant of the third generation type for cardiac assist have been tested in animal studies. A device of completely new design for direct stimulation of denervated muscles is being tested in animal studies. There is a limited choice of technologically suitable biocompatible and bioresistant materials for implants. The physical design has to be anatomically shaped without corners or edges. Electrical conductors carrying direct current (D.C.) have to be placed inside a hermetic metal case. The established sealing materials, silicone rubber and epoxy resin, do not provide hermeticity and should only embed DC-free components. For electrical connections outside the hermetic metal case welding is preferable to soldering; conductive adhesives should be avoided. It is advisable to use a hydrophobic oxide ceramic core for telemetry antenna coils embedded in sealing polymer. Cleaning of all components before sealing in resin is of the utmost importance as well as avoidance of rapid temperature changes during the curing process.
我们可以区分用于激活神经结构的三代功能性电刺激(FES)植入物:1. 射频供电的植入物,其刺激幅度取决于天线位移;2. 射频供电的植入物,其刺激幅度稳定;3. 电池供电的植入物。在维也纳,第二代类型的8通道版本已临床应用于截瘫患者的活动和膈神经起搏。用于截瘫患者活动的第二代类型的20通道植入物和用于心脏辅助的第三代类型的8通道植入物已在动物研究中进行了测试。一种用于直接刺激失神经肌肉的全新设计的装置正在动物研究中进行测试。对于植入物,在技术上合适的生物相容性和生物抗性材料的选择有限。物理设计必须符合解剖学形状,没有角或边。承载直流电(D.C.)的电导体必须放置在密封的金属壳体内。现有的密封材料,硅橡胶和环氧树脂,不能提供密封性,并且只能嵌入无直流电的部件。对于密封金属壳体外部的电气连接,焊接比钎焊更可取;应避免使用导电粘合剂。对于嵌入密封聚合物中的遥测天线线圈,建议使用疏水性氧化物陶瓷芯。在将所有部件密封在树脂中之前进行清洁至关重要,同时在固化过程中要避免温度快速变化。