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通过气相反应对金属碳纳米管进行选择性蚀刻。

Selective etching of metallic carbon nanotubes by gas-phase reaction.

作者信息

Zhang Guangyu, Qi Pengfei, Wang Xinran, Lu Yuerui, Li Xiaolin, Tu Ryan, Bangsaruntip Sarunya, Mann David, Zhang Li, Dai Hongjie

机构信息

Department of Chemistry and Laboratory for Advanced Materials, Stanford University, Stanford, CA 94305, USA.

出版信息

Science. 2006 Nov 10;314(5801):974-7. doi: 10.1126/science.1133781.

Abstract

Metallic and semiconducting carbon nanotubes generally coexist in as-grown materials. We present a gas-phase plasma hydrocarbonation reaction to selectively etch and gasify metallic nanotubes, retaining the semiconducting nanotubes in near-pristine form. With this process, 100% of purely semiconducting nanotubes were obtained and connected in parallel for high-current transistors. The diameter- and metallicity-dependent "dry" chemical etching approach is scalable and compatible with existing semiconductor processing for future integrated circuits.

摘要

金属性和半导体性的碳纳米管通常在生长态材料中共存。我们提出了一种气相等离子体烃化反应,用于选择性地蚀刻和气化金属纳米管,使半导体纳米管保持近乎原始的形态。通过这个过程,获得了100%的纯半导体纳米管,并将它们并联连接以用于高电流晶体管。这种依赖于直径和金属性的“干法”化学蚀刻方法具有可扩展性,并且与未来集成电路的现有半导体工艺兼容。

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