Lu Chunmeng, Lee L James, Juang Yi-Je
Department of Chemical and Biomolecular Engineering, Ohio State University, Columbus, OH, USA.
Electrophoresis. 2008 Apr;29(7):1407-14. doi: 10.1002/elps.200700680.
In this paper, we describe an interstitial bonding technique for packaging of microfluidic chips. The cover plate is first placed on top of the microfluidic chip, followed by dispensing the UV-curable resin into the resin-loading reservoirs. With the interstitial space between the cover plate and the microfluidic chip connecting to the loading reservoirs, the UV-curable resin wicks through capillary force action and hydrostatic pressure generated by the liquid level in the resin-loading reservoirs. When reaching the microchannels, the UV-curable resin stops flowing into the microchannels due to the force balance between the surface tension and hydrostatic pressure. The assembly is then placed under the UV light, followed by further curing in the thermal oven. It is found that there is no leakage from the bonded microfluidic chips and a good DNA separation result was obtained by using the microfluidic chips as fabricated. This bonding technique is relatively simple and fast, which can be applied to the packaging of microfluidic chips made from hybrid materials with complicated designs as long as the interstitial space connects to the loading reservoirs.
在本文中，我们描述了一种用于微流控芯片封装的间隙键合技术。首先将盖板放置在微流控芯片顶部，然后将紫外光固化树脂分配到树脂加载槽中。由于盖板与微流控芯片之间的间隙空间与加载槽相连，紫外光固化树脂通过毛细作用力和树脂加载槽中液位产生的静水压力进行芯吸。当到达微通道时，由于表面张力和静水压力之间的力平衡，紫外光固化树脂停止流入微通道。然后将组件置于紫外光下，接着在热烘箱中进一步固化。结果发现，键合后的微流控芯片没有泄漏，并且使用所制备的微流控芯片获得了良好的DNA分离结果。这种键合技术相对简单且快速，只要间隙空间与加载槽相连，就可应用于由具有复杂设计的混合材料制成的微流控芯片的封装。
