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热塑性微流体键合的最新进展

Recent Advances in Thermoplastic Microfluidic Bonding.

作者信息

Giri Kiran, Tsao Chia-Wen

机构信息

Department of Mechanical Engineering, National Central University, Taoyuan City 320, Taiwan.

出版信息

Micromachines (Basel). 2022 Mar 20;13(3):486. doi: 10.3390/mi13030486.

Abstract

Microfluidics is a multidisciplinary technology with applications in various fields, such as biomedical, energy, chemicals and environment. Thermoplastic is one of the most prominent materials for polymer microfluidics. Properties such as good mechanical rigidity, organic solvent resistivity, acid/base resistivity, and low water absorbance make thermoplastics suitable for various microfluidic applications. However, bonding of thermoplastics has always been challenging because of a wide range of bonding methods and requirements. This review paper summarizes the current bonding processes being practiced for the fabrication of thermoplastic microfluidic devices, and provides a comparison between the different bonding strategies to assist researchers in finding appropriate bonding methods for microfluidic device assembly.

摘要

微流控技术是一项多学科技术,在生物医学、能源、化学和环境等各个领域都有应用。热塑性塑料是聚合物微流控领域最突出的材料之一。良好的机械刚性、耐有机溶剂性、耐酸碱性能以及低吸水性等特性使热塑性塑料适用于各种微流控应用。然而,由于键合方法和要求多种多样,热塑性塑料的键合一直具有挑战性。这篇综述文章总结了目前用于制造热塑性微流控器件的键合工艺,并对不同的键合策略进行了比较,以帮助研究人员找到适用于微流控器件组装的键合方法。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4634/8949906/0358be0b3c5b/micromachines-13-00486-g001.jpg

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