Allen Peter B, Chiu Daniel T
Department of Chemistry, University of Washington, Box 351700, Seattle, Washington 98195, USA.
Anal Chem. 2008 Sep 15;80(18):7153-7. doi: 10.1021/ac801059h. Epub 2008 Aug 9.
Glass is a desired material for many microfluidics applications. It is chemically resistant and has desirable characteristics for capillary electrophoresis. The process to make a glass chip, however, is lengthy and inconvenient, with the most difficult step often being the bonding of two planar glass substrates. Here we describe a new glass bonding technique, which requires only washing of the glass surfaces with a calcium solution and 1-2 h of bonding at 115 degrees C. We found calcium uniquely allows for this simple and efficient low-temperature bonding to occur, and none of the other cations we tried (e.g., Na (+), Mg (2+), Mn (3+)) resulted in satisfactory bonding. We determined this bond is able to withstand high applied field strengths of at least up to 4 kV x cm (-1). When intense pressure was applied to a fluid inlet, a circular portion of the coverslip beneath the well exploded outward but very little of the glass-glass interface debonded. In combination with the directed hydrofluoric acid etching of a glass substrate using a poly(dimethylsiloxane) (PDMS) etch guide, we were able to make glass chips with better than 90% yield within 6 h. This technique is compatible with inexpensive unpolished glass and is limited in resolution by the PDMS etch guide used and the intrinsic properties of isotropic etching.
玻璃是许多微流控应用中理想的材料。它具有化学抗性,且具备适合毛细管电泳的特性。然而,制造玻璃芯片的过程冗长且不便,其中最困难的步骤通常是两个平面玻璃基板的键合。在此,我们描述一种新的玻璃键合技术,该技术仅需用钙溶液清洗玻璃表面,并在115摄氏度下键合1至2小时。我们发现钙能独特地促成这种简单高效的低温键合,而我们尝试的其他阳离子(如Na(+)、Mg(2+)、Mn(3+))均未实现令人满意的键合。我们确定这种键合能够承受至少高达4 kV x cm(-1)的高外加场强。当向流体入口施加高压时,孔下方盖玻片的圆形部分向外爆开,但玻璃-玻璃界面几乎没有脱粘。结合使用聚二甲基硅氧烷(PDMS)蚀刻导向器对玻璃基板进行定向氢氟酸蚀刻,我们能够在6小时内以超过90%的产率制造玻璃芯片。该技术与廉价的未抛光玻璃兼容,并且受所用PDMS蚀刻导向器和各向同性蚀刻的固有特性限制,分辨率有限。