微机电系统/纳机电系统弯曲模式谐振器中的热弹性耗散

Thermoelastic dissipation in MEMS/NEMS flexural mode resonators.

作者信息

Yan Jize, Seshia Ashwin A

机构信息

Department of Engineering and Nanoscience Centre, University of Cambridge, CB2 1PZ, UK.

出版信息

J Nanosci Nanotechnol. 2009 Feb;9(2):1011-4. doi: 10.1166/jnn.2009.c075.

DOI:10.1166/jnn.2009.c075

PMID:19441443

Abstract

Understanding the energy dissipation mechanisms in single-crystal silicon MEMS/NEMS resonators are particularly important to maximizing an important figure of merit relevant for miniature sensor and signal processing applications: the Quality factor (Q) of resonance. This paper discusses thermoelastic dissipation (TED) as the dominant internal-friction mechanism in flexural mode MEMS/NEMS resonators. Criteria for optimizing the geometrical design of flexural mode MEMS/NEMS resonators are theoretically established with a view towards minimizing the TED for single-crystal silicon MEMS/NEMS flexural mode resonators.

摘要

了解单晶硅微机电系统/纳机电系统（MEMS/NEMS）谐振器中的能量耗散机制，对于最大化与微型传感器和信号处理应用相关的一个重要品质因数：谐振品质因数（Q）而言尤为重要。本文讨论了热弹性耗散（TED）作为弯曲模式MEMS/NEMS谐振器中主要的内摩擦机制。从最小化单晶硅MEMS/NEMS弯曲模式谐振器的TED角度出发，从理论上建立了优化弯曲模式MEMS/NEMS谐振器几何设计的准则。