Cupron Scientific, Modi'in, Israel.
Wound Repair Regen. 2010 Mar-Apr;18(2):266-75. doi: 10.1111/j.1524-475X.2010.00573.x. Epub 2010 Mar 12.
ABSTRACT Copper plays a key role in angiogenesis and in the synthesis and stabilization of extracellular matrix skin proteins, which are critical processes of skin formation. We hypothesized that introducing copper into wound dressings would enhance wound repair. Application of wound dressings containing copper oxide to wounds inflicted in genetically engineered diabetic mice (C57BL/KsOlaHsd-Lepr(db)) resulted in increased gene and in situ up-regulation of proangiogenic factors (e.g., placental growth factor, hypoxia-inducible factor-1 alpha, and vascular endothelial growth factor), increased blood vessel formation (p<0.05), and enhanced wound closure (p<0.01) as compared with control dressings (without copper) or commercial wound dressings containing silver. This study proves the capacity of copper oxide-containing wound dressings to enhance wound healing and sheds light onto the molecular mechanisms by which copper oxide-impregnated dressings stimulate wound healing.
摘要 铜在血管生成以及细胞外基质皮肤蛋白的合成和稳定中发挥着关键作用，而这些过程是皮肤形成的关键。我们假设，在伤口敷料中引入铜可以促进伤口修复。将含有氧化铜的伤口敷料应用于基因工程糖尿病小鼠（C57BL/KsOlaHsd-Lepr(db)）造成的伤口，与对照组敷料（不含铜）或含有银的商业伤口敷料相比，可导致促血管生成因子（如胎盘生长因子、缺氧诱导因子-1α和血管内皮生长因子）的基因和原位上调，增加血管形成（p<0.05），并加速伤口闭合（p<0.01）。本研究证明了含氧化铜的伤口敷料能够增强伤口愈合，并揭示了氧化铜浸渍的敷料刺激伤口愈合的分子机制。
