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新型金属自动电化学-机械抛光(ECMP)用于扫描电子显微镜。

Novel automatic electrochemical-mechanical polishing (ECMP) of metals for scanning electron microscopy.

机构信息

Air Force Research Laboratory, Materials and Manufacturing, Wright-Patterson AFB, OH 45433, USA.

出版信息

Micron. 2010 Aug;41(6):615-21. doi: 10.1016/j.micron.2010.03.008. Epub 2010 Mar 30.

DOI:10.1016/j.micron.2010.03.008
PMID:20434348
Abstract

A low-stress automated polishing device was developed for preparing titanium and nickel alloys for scanning electron microscopy imaging. The system used pulsed electrochemical reactions within an alkaline electrolyte to generate a thin passivation layer on the surface of the sample, which was removed by the mechanical vibration of the system. The passivation layer development and removal were documented for Ti-6Al-4V and IN718 samples subjected to varying electrical potential cycles and polishing times. Results indicated that the applied cyclic potentials removed material faster than typical removal techniques. In addition, electron back scatter diffraction data showed a decrease in subsurface damage using the developed electrochemical-mechanical process compared to standard mechanical polishing techniques.

摘要

一种低应力自动化抛光设备被开发出来,用于准备钛和镍合金进行扫描电子显微镜成像。该系统在碱性电解液中利用脉冲电化学反应在样品表面生成一层薄的钝化层,然后通过系统的机械振动将其去除。对 Ti-6Al-4V 和 IN718 样品进行了不同的电位循环和抛光时间的钝化层发展和去除实验。结果表明,施加的循环电位比典型的去除技术去除材料的速度更快。此外,电子背散射衍射数据表明,与标准机械抛光技术相比,开发的电化学-机械工艺可减少亚表面损伤。

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