Department of Orthodontics, Seoul National University, South Korea.
Angle Orthod. 2011 Mar;81(2):326-33. doi: 10.2319/062210-343.1.
To test the hypothesis that orthodontic bonding has no effect on the initial adhesion of mutans streptococci (MS) in the presence of saliva.
Hydroxyapatite (HA) and orthodontic adhesive (AD) disks were prepared to a uniform size. HA disks were etched with 37% phosphoric acid (HE, etched group). Some of the HE disks were coated with Transbond XT primer and light cured (HP, primed group). Transbond Plus SEP was applied to a third set of HA disks, dried, and light cured (SEP, self-etching primer group). Adhesion assays were performed using two MS strains in the presence of fluid-phase or surface-adsorbed unstimulated whole saliva (UWS). The MS adhesion patterns were examined by scanning electron microscopy.
MS adhesion was influenced by the bonding steps and the presence of UWS. UWS treatment decreased MS adhesion. However, surface-adsorbed UWS resulted in slightly less inhibition of MS adhesion than fluid-phase UWS. MS adhesion was significantly greater for HE than for the other groups. There were interaction effects between the UWS treatment and surface groups. MS adhesion to HP and AD was significantly diminished in the presence of surface-adsorbed or fluid-phase UWS compared with adhesion to HA, HE, or SEP.
The hypothesis is rejected. Our results suggest that MS adhesion is significantly influenced by the bonding procedure used, and the application of conventional primers for the bracket bonding can inhibit MS adhesion to tooth surfaces in the presence of UWS.
检验这样一个假设,即在唾液存在的情况下,正畸粘接对变形链球菌(MS)初始黏附没有影响。
制备羟基磷灰石(HA)和正畸粘接剂(AD)圆盘,使其大小均匀。HA 圆盘用 37%磷酸(HE,蚀刻组)蚀刻。一些 HE 圆盘用 Transbond XT 底漆覆盖并光固化(HP,底漆组)。第三组 HA 圆盘涂有 Transbond Plus SEP,干燥后光固化(SEP,自酸蚀底漆组)。使用两种 MS 菌株在流体相或表面吸附的未刺激全唾液(UWS)存在下进行黏附测定。通过扫描电子显微镜检查 MS 的黏附模式。
黏附步骤和 UWS 的存在影响了 MS 的黏附。UWS 处理降低了 MS 的黏附。然而,与流体相 UWS 相比,表面吸附的 UWS 对 MS 黏附的抑制作用稍小。HE 组的 MS 黏附明显大于其他组。UWS 处理与表面基团之间存在相互作用效应。与 HA、HE 或 SEP 相比,在存在表面吸附或流体相 UWS 的情况下,HP 和 AD 对 MS 的黏附显著减少。
该假设被拒绝。我们的结果表明,MS 的黏附明显受所用粘接程序的影响,在 UWS 存在的情况下,常规基底粘接用底漆的应用会抑制 MS 对牙面的黏附。