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通过削弱 Cu 细丝的形成/断裂的随机性来改善 Cu/ZnO/Pt 三明治的电阻开关性能。

Improvement of resistive switching in Cu/ZnO/Pt sandwiches by weakening the randomicity of the formation/rupture of Cu filaments.

机构信息

Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Material Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, People's Republic of China.

出版信息

Nanotechnology. 2011 Jul 8;22(27):275204. doi: 10.1088/0957-4484/22/27/275204. Epub 2011 May 25.

DOI:10.1088/0957-4484/22/27/275204
PMID:21613680
Abstract

We report an improvement in minimizing the dispersion of resistive switching (RS) parameters such as ON/OFF state resistances and switching voltages of Cu/ZnO/Pt structures in which ZnO films have been deposited at elevated temperature with N doping. This deposition process can enlarge the ZnO grain size and lessen grain boundaries while maintaining a high initial resistance since ZnO naturally shows n-type conductivity and N is a p-type dopant but with a low solubility. Cu filaments with a diameter of 15 nm are found to form at the ZnO grain boundaries. Therefore, fewer grain boundaries could depress the randomicity of the formation/rupture of Cu filaments and result in more stable RS performances. Such memory devices show a fast programming speed of 10 ns.

摘要

我们报告了一种改进方法,可以最小化 Cu/ZnO/Pt 结构中电阻开关 (RS) 参数的分散性,例如 ZnO 薄膜在高温下沉积并进行 N 掺杂时的 ON/OFF 状态电阻和开关电压。这种沉积工艺可以增大 ZnO 晶粒尺寸并减少晶界,同时保持较高的初始电阻,因为 ZnO 本身表现出 n 型导电性,而 N 是 p 型掺杂剂,但溶解度较低。在 ZnO 晶界处发现直径为 15nm 的 Cu 细丝。因此,较少的晶界可以抑制 Cu 细丝的形成/断裂的随机性,从而产生更稳定的 RS 性能。这种存储器件具有 10ns 的快速编程速度。

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