Frey Laurent, Parrein Pascale, Raby Jacques, Pellé Catherine, Hérault Didier, Marty Michel, Michailos Jean
CEA, LETI, MINATEC, Grenoble, France.
Opt Express. 2011 Jul 4;19(14):13073-80. doi: 10.1364/OE.19.013073.
A color image was taken with a CMOS image sensor without any infrared cut-off filter, using red, green and blue metal/dielectric filters arranged in Bayer pattern with 1.75 µm pixel pitch. The three colors were obtained by a thickness variation of only two layers in the 7-layer stack, with a technological process including four photolithography levels. The thickness of the filter stack was only half of the traditional color resists, potentially enabling a reduction of optical crosstalk for smaller pixels. Both color errors and signal to noise ratio derived from optimized spectral responses are expected to be similar to color resists associated with infrared filter.
使用像素间距为1.75µm的拜耳图案排列的红色、绿色和蓝色金属/介质滤光片,通过没有任何红外截止滤光片的CMOS图像传感器拍摄彩色图像。这三种颜色仅通过7层堆叠中两层的厚度变化获得,其工艺流程包括四个光刻级别。滤光片堆叠的厚度仅为传统彩色抗蚀剂的一半,这可能会减少较小像素的光学串扰。预计从优化的光谱响应得出的颜色误差和信噪比与与红外滤光片相关的彩色抗蚀剂相似。