Department of Chemistry, Sogang University, #1 Shinsu-dong, Mapo-gu, Seoul 121-742, Republic of Korea.
J Colloid Interface Sci. 2012 Jan 1;365(1):103-9. doi: 10.1016/j.jcis.2011.09.041. Epub 2011 Sep 24.
Copper nanoparticles are prepared in aqueous solution by reducing copper ions with hydrazine hydrate in the presence of cetyl trimethylammonium bromide (CTAB) and polyvinylpyrrolydone (PVP) as stabilizers. With only CTAB was used as stabilizer, copper nanoparticles are aggregated and partially oxidized to Cu(2)O. When both PVP and CTAB were used, dispersed copper nanoparticles with 56 nm diameter were obtained. Copper nanoparticles are simply mixed with poly (3,4-ethylenedioxythiophene)/poly(styrenesulfonate) (PEDOT/PSS) in aqueous solution to form conducting composite. The effect of copper weight percent and surfactants on the conductivity and stability of the composite has been investigated.
铜纳米粒子在水溶液中通过使用水合肼将铜离子还原，同时以十六烷基三甲基溴化铵（CTAB）和聚乙烯吡咯烷酮（PVP）作为稳定剂。只用 CTAB 作为稳定剂时，铜纳米粒子会聚集并部分氧化为 Cu(2)O。当同时使用 PVP 和 CTAB 时，可得到分散的铜纳米粒子，其直径为 56nm。铜纳米粒子简单地与聚（3,4-亚乙基二氧噻吩）/聚（苯乙烯磺酸盐）（PEDOT/PSS）在水溶液中混合，形成导电复合材料。研究了铜的重量百分比和表面活性剂对复合材料的电导率和稳定性的影响。
