Department of Materials Science and Engineering, Korea University, Seoul 136-713, Republic of Korea.
Small. 2012 Sep 24;8(18):2849-55. doi: 10.1002/smll.201200488. Epub 2012 Jun 22.
We demonstrate that resistance random access memory (RRAM) can be fabricated based on CdS-nanocrystal thin films. A simple drop-drying of the CdS-nanocrystal solution leads to the formation of uniform thin films with controlled thickness. RRAMs with a Ag/Al(2) O(3) /CdS/Pt structure show bipolar switching behavior, with average values of the set voltage (V(Set) ) and reset voltage (V(Reset) ) of 0.15 V and -0.19 V, respectively. The RRAM characteristics are critically influenced by the thickness of the Al(2) O(3) barrier layer, which prevents significant migration of Ag into the CdS layer as revealed by Auger electron spectroscopy (AES). Interestingly, RRAM without an Al(2) O(3) layer (i.e., Ag/CdS/Pt structure) also shows bipolar switching behavior, but the polarity is opposite to that of RRAM with the Al(2) O(3) layer (i.e., Ag/Al(2) O(3) /CdS/Pt structure). The operation of both kinds of devices can be explained by the conventional conductive bridging mechanism. Additionally, we fabricated RRAM devices on Kapton film for potential applications in flexible electronics, and the performance of this RRAM device was comparable to that of RRAMs fabricated on hard silicon substrates. Our results show a new possibility of using chalcogenide nanocrystals for RRAM applications.
我们证明了可以基于 CdS 纳米晶薄膜来制造电阻式随机存取存储器(RRAM)。通过简单的 CdS 纳米晶溶液滴涂,可以形成具有可控厚度的均匀薄膜。具有 Ag/Al2O3/CdS/Pt 结构的 RRAM 表现出双极性开关行为,其设定电压(VSet)和重置电压(VReset)的平均值分别为 0.15 V 和-0.19 V。RRAM 的特性受到 Al2O3 势垒层厚度的极大影响,正如俄歇电子能谱(AES)所揭示的那样,这可以防止 Ag 大量迁移到 CdS 层中。有趣的是,没有 Al2O3 层的 RRAM(即 Ag/CdS/Pt 结构)也表现出双极性开关行为,但极性与具有 Al2O3 层的 RRAM(即 Ag/Al2O3/CdS/Pt 结构)相反。两种器件的工作原理都可以用传统的导电桥接机制来解释。此外,我们还在 Kapton 薄膜上制造了 RRAM 器件,以期在柔性电子学中得到应用,并且该 RRAM 器件的性能与在硬硅衬底上制造的 RRAM 器件相当。我们的结果表明了使用硫属化物纳米晶体进行 RRAM 应用的新可能性。