Lindenmann N, Balthasar G, Hillerkuss D, Schmogrow R, Jordan M, Leuthold J, Freude W, Koos C
Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany.
Opt Express. 2012 Jul 30;20(16):17667-77. doi: 10.1364/OE.20.017667.
Photonic integration requires a versatile packaging technology that enables low-loss interconnects between photonic chips in three-dimensional configurations. In this paper we introduce the concept of photonic wire bonding, where polymer waveguides with three-dimensional freeform geometries are used to bridge the gap between nanophotonic circuits located on different chips. In a proof-of-principle experiment, we demonstrate the fabrication of single-mode photonic wire bonds (PWB) by direct-write two-photon lithography. First-generation prototypes allow for efficient broadband coupling with average insertion losses of only 1.6 dB in the C-band and can carry wavelength-division multiplexing signals with multi-Tbit/s data rates. Photonic wire bonding is well suited for automated mass production, and we expect the technology to enable optical multi-chip systems with enhanced performance and flexibility.
光子集成需要一种通用的封装技术，该技术能够在三维配置中实现光子芯片之间的低损耗互连。在本文中，我们介绍了光子引线键合的概念，其中具有三维自由形状几何结构的聚合物波导用于弥合位于不同芯片上的纳米光子电路之间的间隙。在原理验证实验中，我们展示了通过直写双光子光刻技术制造单模光子引线键合（PWB）。第一代原型实现了高效宽带耦合，在C波段平均插入损耗仅为1.6 dB，并且能够承载具有多太比特每秒数据速率的波分复用信号。光子引线键合非常适合自动化大规模生产，我们预计该技术将实现具有更高性能和灵活性的光学多芯片系统。
